Just four years ago, the Open Compute Project was essentially a vision for designing and enabling the delivery of highly efficient hyperscale data center components based on open specifications. Today, the vision for the OCP initiative has come alive in the form of real innovations in servers, racks, storage, and networking.
The latest of these innovations will take center stage this week at the Open Compute Project U.S. Summit 2015 in San Jose. The OCP Summit is an opportunity for OCP aligned vendors to showcase contributions and advancements for DC platforms and components, while OCP adopters share requirements and learning from using OCP products in their data centers.
At Intel, we’re committed to the OCP mission and to playing a meaningful role in delivering the data center of the future. Over the past four years, we have made significant contributions in the form of servers, racks, storage, and networking components that comply with OCP specifications.
These contributions range from Intel® Xeon® Processor E5 boards to bare-metal Ethernet switch specifications and Ethernet cards aligned with OCP specifications. Through engineering collaborations with the OCP ecosystem, we have enabled a range of OCP-compliant systems and boards delivered by our partners. Today we have more than 40 Intel based products from our Open Compute ecosystem partners available for adoption.
At this year’s Summit, you can expect to hear more news from Intel, our partners and end users who are embracing OCP. We have new products and designs to talk about spanning compute, network and storage. With that in mind, be sure to catch the keynote address from Jason Waxman, Vice President of the Intel Cloud Platforms Group, and Tuesday morning at 10:45am.
These are exciting times for organizations that are committed to using or developing data center components based on openly shared specifications. Working together, we are all making the Open Compute vision a reality.
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