Open Compute Project


How to Contribute

There are many opportunities for individuals and companies to get involved with the OCP community.


  • Join a current project

  • Download, Read, and Offer comments and suggestions on current and developing specifications and designs.

  • Feed ideas for new projects to the incubation committee.

  • Contribute a hardware or software

  • Have Products recognized as OCP-ACCEPTED™ or OCP-INSPIRED™


To become an OCP Tiered Member of the Open Compute Project Foundation please complete the OCP Membership Agreement. The individual membership agreement can be signed by creating an account/profile on the website. Once you've done that, please pick the projects you are interested in and sign up for those mailing lists.   If you or your organization decide to contribute Intellectual Property (Specs/Designs) or want to have your Product Recognized as OCP-ACCEPTED™ or OCP-INSPIRED™ then you will need see the 'Contribute' section below.

Tiered Membership:

The following is a list of all the areas where you can get involved and join the discussion: 

Spec/Design Submissions:

The instructions for how to submit specs/designs to OCP can be found here.

Online Community 

Stay informed:

In-Person events

OCP Summits: The Open Compute Project Foundation will host its large summits annually. Here are a few ways you can participate:

  • If your company is interested in sponsoring an OCP Summit, please contact and we'd be happy to share upcoming opportunities.

  • Attend a summit! The next OCP Summit will be held in the SF Bay Area in January of 2014. Stay tuned for more information.

  • If you're interested in leading a technical workshop or presenting at a future summit, please contact

Engineering Workshops: The Open Compute Project Foundation hosts a series of engineering workshops each year to build the community. Registration for these is capped at 100 attendees, as they are working sessions.  The goals of the engineering workshops are:

  • Increased community participation and stickiness.

  • Increase the OCP technology portfolio; depth and breadth of specifications and charters.

  • Drive the product-ionization of OCP’s specifications.  A good example here is the Intel’s interconnect technology that enables Sipho.

  • Solidify specification versioning pipeline, release process, naming conventions.

  • Take into account/understand the suppliers needs and OCP partners needs; AMDs Roadrunner and the associated release and deployment is a good example here.

  • Implementation of OCP’s legal framework (CLA’s, OWFa’s).

  • Building out/addressing technologies for new sectors.

If you are interested in sponsoring an upcoming engineering workshop, please contact