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==Welcome==
==Welcome==


Welcome to the OCP Mezzanine NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in Mezzanine NIC space, under OCP framework.
Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.


===Guideline===
===Guideline===
Line 27: Line 27:
==Get Involved==
==Get Involved==


===0v70 Release Candidate Package ===


===Updates===
{| class="wikitable"
'''6/20/2017'''
|-
! Specification Package
! Version
! Date
! Contributor
! Notes
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=03b815ef7595fca0e20b5c27b07f992b OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB]
| 0v70
| 1/25/2018
| OCP NIC subgroup
| Specification without comment bar for Server WG and IC review
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ed2b9296d00618efbe4c8216a6bb1b77 OCP_NIC_3.0_3D_CAD_0v70_20180122]
| 0v70
| 1/22/2018
| OCP NIC subgroup
| Mechanical 3D CAD models
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=04ab98afb725e17401c17c0f72d9044b OCP_NIC_3.0_2D_Drawings_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Mechanical 2D Drawings
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=3c2813cb2539c0dd9b279de5327ec220 OCP_NIC_3.0_thermal_models_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal CFD model(PACK) with Mechanical model(STEP) extracted
 
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ea4bfe9d5e2399e8f4135e6c48cafe38 OCP_NIC_3.0_thermal_TestFixture_0v70_20180124]
| 0v70
| 1/24/2018
| OCP NIC Subgroup
| Thermal test fixture mechanical model(STEP) for small form factor add-in-card


See below for material for tomorrow's call:
|}


[http://files.opencompute.org/oc/public.php?service=files&t=c6cd05fb6c2046c878ac7c9ddb010e31 Summary of simulation results under stand-by power]
===Updated Doc===


[http://files.opencompute.org/oc/public.php?service=files&t=76c7973c379d6849e7bc0d96eeb95a73 Presentation slides]
{| class="wikitable"
|-
! Doc
! Version
! Date
! Contributor
! Notes


--- '''Agenda'''
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=f0acc190ff1ea4245d3be642a8366de6 OCP NIC 3.0 rev_tracking_20180417]
| 20180417
| 4/17/2018
| OCP NIC subgroup
| This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.


1. Review latest round of simulation results
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=88bea5aed06c2e01c32f756c08ec3d78 OCP_NIC_3.0_draft_0v72_20180221a_TN]
| 0v72
| 2/21/2018
| Intel
| 0v72


2. Go over a few topics for discussion


|-
| [http://files.opencompute.org/oc/public.php?service=files&t=96d0f772b1677ceb327590c62b6f2a14 OCP 3.0 Pinout 0v72_20180222a_TN]
| 0v72
| 2/22/2018
| Intel
| Pinout table


'''6/6/2017'''


See below for material for tomorrow's call:
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=fb6459537cb2cf7a77a02b0b86247bec OCP_NIC_3.0_discussion_r12_20180123]
| v12
| 1/23/2018
| OCP NIC Subgroup
| Presentation to Server WG/IC


[http://files.opencompute.org/oc/public.php?service=files&t=7d19f143ec3f3109117904caf4a198cc Updated thermal model: Cases A1-A5]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6b94014ed393a1229c0d3c296c0fc3a0 Mezz3.0 schedule v7_20180123]
| v7
| 1/23/2018
| Facebook
| OCP NIC 3.0 spec project schedule


[http://files.opencompute.org/oc/public.php?service=files&t=776e636799258da85c562f69e22e05ae Updated thermal model: Cases A6-A10]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=e4c9401b56215bd33ea4f37336710c48 OCP NIC 3.0_Mechanical Discussion_v5_20171201_d]
| v5
| 12/01/2017
| Facebook
| Mechanical Deck


[http://files.opencompute.org/oc/public.php?service=files&t=7018dd736da61bf1a44030d4a582ce26 Updated thermal model: Cases D1-D8]


[http://files.opencompute.org/oc/public.php?service=files&t=b86d25485cf6f4c191c9c2fec2806e73 Summary of simulation results using updated thermal models]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=420aabdf9be26d4d3c90cb199a4cd369 Thermal Deck_v7_20171115]
| v7
| 11/15/2017
| Facebook
| Thermal deck


[http://files.opencompute.org/oc/public.php?service=files&t=0f43d212fb481bca0efd5befbed07af1 Presentation slides]
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=6e30e729b094d6c5f3a2eb49c7611901 Updated thermal Simulation Results_v7_20171103]
| v7
| 11/3/2017
| Facebook
| Thermal simulation result update


--- '''Agenda'''
|-  
| [http://files.opencompute.org/oc/public.php?service=files&t=260bfb5257a2466f6bd4490ff31f3358 OCP_Mezz_thermal_model_v3_20171103]
| v3
| 11/3/2017
| Facebook
| Thermal simulation model package


1. Review changes to thermal models based on feedback from the community
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=bf394a4b8394ece800712a690a06bf57 HPE_Comments_on_OCP_Mezz_v3_20170816]
| N/A
| 8/16/2017
| HPE
| Presentation from HPE on 8/16/2017 call


2. Review latest round of simulation results
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=7d48739a75eb23c5ad5805f5451233df Dell EMC - OCP NIC Presntation v1_20170906]
| v1
| 9/6/2017
| Dell-EMC
| Presentation from Dell-EMC on 9/6/2017 call


3. Go over a few topics for discussion
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=ad9c60f6e25a5d2eaa38cc72f8b22069 Lenovo OCP Mezz3.0 Recommendations - 20170901]
| N/A
| 9/1/2017
| Lenovo
| A mechanical focused presentation from Lenovo on 9/6/2017 call


|-
| [http://files.opencompute.org/oc/public.php?service=files&t=a4f6fee57057e7e888f0f39b5661c8cf 9/25/2017 Workshop decks]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop slides from multiple contributors 


'''5/16/2017'''
|-
| [http://files.opencompute.org/oc/public.php?service=files&t=79d8d76c1942bc15d65776392c5fd411 9/25/2017 Workshop recording (large file 908MB)]
| N/A
| 9/25/2017
| Microsoft / TE / Amphenol / Broadcom / Intel / Facebook
| 9/25/2017 workshop recording from multiple contributors 


Here are the update in the past 2x weeks, and material for tomorrow's call:
|}


[http://files.opencompute.org/oc/public.php?service=files&t=5fd1d10bed7d85c6876478a975b7c867 Updated thermal simulation case deck:Thermal Simulation Feedback_20170517]
===Updates===


[http://files.opencompute.org/oc/public.php?service=files&t=9e5450687380a5c97feab23a3c0ccaf3 Update thermal simulation case spreadsheet: Updated Thermal Simulation Cases_20170511]


Additional questions to NIC suppliers:
'''1/19/2018 update'''


- Standby(S5) power of NIC, or ratio of P_Standby / P_Max
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=663f885d9dbbf9bcee8bab0e6adbe77f OCP_NIC_3.0_draft_0v63_20180119e_TN]


- P_standby of Optical modules




'''1/18/2018 update'''


'''4/28/2017'''
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=7cd6c3ed5710b9c36e77eb164fe44718 OCP_NIC_3.0_draft_0v62_20180118f_TN]


As we kicked off the discussion of Mezz thermal simulation on 4/19, here are the updates: 


[http://files.opencompute.org/oc/public.php?service=files&t=cd97fcf9d20789a0128cdb4380f26f69 OCP Mezz 3.0 Thermal Simulation Description]


[http://files.opencompute.org/oc/public.php?service=files&t=1a8ba4c5533db8696ea9fd1f5a9d8a8b OCP Mezz 3.0 Thermal Simulation Package]
'''1/16/2018 update'''


Please give your feedback in mailing list and we will talk about it on next call on 5/3.  
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=2ab0d4e234abf29f37e6298c72d1c236 OCP_NIC_3.0_draft_0v60_20180116e_TN]


'''4/17/2017'''


We have an updated schedule for comment and feedback:
[http://files.opencompute.org/oc/public.php?service=files&t=85117a6af40281399d13b87745f2c1ae Schedule Update V2]


Mezz 3.0 Survey is closed with 5 participants; Summary with company names masked can be found here:
'''1/15/2018 update'''
[http://files.opencompute.org/oc/public.php?service=files&t=2f76191e6e3f7af67373148de827db77 Mezz 3.0 Survey filled 201704016]


A few updates were made to the master deck:
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=f1a9f7e9027c24418f0d10a830e882ae OCP_NIC_3.0_draft_0v57_20180109c_TN]
[http://files.opencompute.org/oc/public.php?service=files&t=a906c9f2492d3d74e1053a4a82ba8331 Mezz 3.0 General Update]


Our next call is on 4/19/2017 Wednesday 9am PDT(2nd call of the month). As always, call-in info can be found [http://opencompute.org/community/ocp-calendars here].


--- '''Agenda'''
'''1/2/2018 update'''


1. Sync with community about schedule refresher and get feedback for schedule and milestone
1. Update spec draft to [http://files.opencompute.org/oc/public.php?service=files&t=fad43541dfd5abb8265663ec93164e99 OCP_NIC_3.0_draft_0v50_20171222i_TN]


2. Summary of survey
2. Move updates before 12/1/2017 to [http://www.opencompute.org/wiki/Server/Mezz/Update_Archive archive]


3. John Fernandes will share methodology for thermal simulation


4. Call for more feedback on a few options (9,10,11,12)
'''12/20/2017 update'''


1. Updated spec draft, overview deck, and mechanical deck




'''12/5/2017 update'''


1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN


'''3/29/2017'''
2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN


1. Ramp NIC survey template version to v03 to have more exact wording.  [http://files.opencompute.org/oc/public.php?service=files&t=888e8eb91172c13653c0bf733ca3b27f Template v03]
3. Specification draft complete rate (Estimation)


2. Due to the limitation of mailing-list with attachment, please send the filled template to [mailto:jia.ning@ocproject.net jia.ning@ocproject.net]. Jia will aggregate and update to the wiki based on your selection of the confidential level (cell B6,B7 of the template v03)
{| class="wikitable"
|-
! Chapter
! Draft complete rate
! Status


3. [http://files.opencompute.org/oc/public.php?service=files&t=399a90213e5fe9004c79e7bd0be5041e Schedule proposal v01] is available for review and comment. A few notes:
|-
|1. Overview
| 70% drafted
| finishing up / under review


- Overall it includes 3x stages: Information collection => Narrow down direction => work out details and 1st draft
|-
|2. Card form factor
| 60+% drafted
| finishing up / under review


- The v01 schedule is on the aggressive side, i.e. the best case scenario when everything goes as expected.  
|-
|3. Card Edge and baseboard interface
| 80+ % drafted
| Under review


- Please review it, give inputs in mailing-list, and discuss in the call next week.
|-
|4. Management
|0% drafted
|Need to work on


|-
|5. Data Network requirement
|TBD
|Same content as Mezz 2.0; check for need to keep this chapter


|-
|6. Card routing guideline and SI consideration
|TBD
|NC-SI specified on card; PCIe TBD


'''3/24/2017'''
|-
|7. Thermal and Environmental
|TBD
|Need edit based on Mezz 2.0


An [http://files.opencompute.org/oc/public.php?service=files&t=4baf98af7f736844e149508321370650 improved version of survey template v02] is created.
|}
All NIC suppliers are strongly recommend to participate to influence Mezz 3.0.
Inputs from System supplier and Hyper-scale/CSP are welcome as well.


Agenda for next meeting (4/5)
4. Key mechanical updates:


1. Review overall Mezz 3.0 work schedule
- Agreed on guiding feature and card sizes


2. Review the boundary with the context of major options
- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)


3. Pick major option branches to perform more detailed study
To be closed:


- Front bracket / latching mechanism design for small and large form factors


'''3/22/2017'''
- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis


A survey of boundary condition of typical use cases is going on.
- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


Detail see [http://lists.opencompute.org/pipermail/opencompute-mezz-card/2017-March/000003.html here]


Please reply to mailing-list to share your boundary condition of Mezz3.0 or write to [mailto:jia.ning@ocproject.net Jia Ning]
5. Coming working sessions and proposal of agenda:


'''3/14/2017'''
-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work
 
-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed
 
-#9 12/20: 3-4hr: Review changes and post 1st draft


1. [https://www.youtube.com/watch?v=M9vg974Ww_4 Video of 3/17/2017 OCP Server workshop talk - Mezz 2.0 and beyond]


2. [http://files.opencompute.org/oc/public.php?service=files&t=6f58019848967b203deefef128c0aa04 Slide deck of 3/9/2017 workshop ]


3. [http://files.opencompute.org/oc/public.php?service=files&t=98ba555198e7083741fefbbf6794c12d Visco file for placement study]




Line 180: Line 313:
This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.
This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.


Call-in info and source of truth @ http://opencompute.org/community/ocp-calendars (Time zone shown: Eastern Time)  
Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)  


This call is open to the public.
This call is open to the public.
Line 188: Line 321:
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]
Meeting minutes is sent out in mailing list and can be found at [http://lists.opencompute.org/pipermail/opencompute-mezz-card/ archive]


===Recordings from Past Calls===
:- [http://files.opencompute.org/oc/public.php?service=files&t=6296c3d7ebed645accc69b5a5668c09e April 18th, 2018]
:- [http://files.opencompute.org/oc/public.php?service=files&t=ac2976a35455b6870f9b0090ad84ffee April 4th, 2018]


===Events===
===Events===

Revision as of 16:23, 19 April 2018

Welcome

Welcome to the OCP NIC subgroup under OCP Server Work Group. The goal of this subgroup is to form a healthy ecosystem in OCP NIC space, under OCP framework.

Guideline

We are here to build a supportive, informative and inclusive community:


Supportive

- Support implementation questions

- Evaluate new use cases

Informative

- Share the latest topics and trends related to OCP Mezz NIC spec

- Share both challenges and opportunities

Inclusive

- Take community feedback and make iterations to proposal before submitting major revision to work group and IC

- Open to both adopters, and observers

Get Involved

0v70 Release Candidate Package

Specification Package Version Date Contributor Notes
OCP_NIC_3.0_draft_0v70_20180125c_TN_no_CB 0v70 1/25/2018 OCP NIC subgroup Specification without comment bar for Server WG and IC review
OCP_NIC_3.0_3D_CAD_0v70_20180122 0v70 1/22/2018 OCP NIC subgroup Mechanical 3D CAD models
OCP_NIC_3.0_2D_Drawings_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Mechanical 2D Drawings
OCP_NIC_3.0_thermal_models_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal CFD model(PACK) with Mechanical model(STEP) extracted
OCP_NIC_3.0_thermal_TestFixture_0v70_20180124 0v70 1/24/2018 OCP NIC Subgroup Thermal test fixture mechanical model(STEP) for small form factor add-in-card

Updated Doc

Doc Version Date Contributor Notes
OCP NIC 3.0 rev_tracking_20180417 20180417 4/17/2018 OCP NIC subgroup This spreadsheet tracks the changes being discussed; Please follow this closely if you have design in pipeline.
OCP_NIC_3.0_draft_0v72_20180221a_TN 0v72 2/21/2018 Intel 0v72


OCP 3.0 Pinout 0v72_20180222a_TN 0v72 2/22/2018 Intel Pinout table


OCP_NIC_3.0_discussion_r12_20180123 v12 1/23/2018 OCP NIC Subgroup Presentation to Server WG/IC
Mezz3.0 schedule v7_20180123 v7 1/23/2018 Facebook OCP NIC 3.0 spec project schedule
OCP NIC 3.0_Mechanical Discussion_v5_20171201_d v5 12/01/2017 Facebook Mechanical Deck


Thermal Deck_v7_20171115 v7 11/15/2017 Facebook Thermal deck
Updated thermal Simulation Results_v7_20171103 v7 11/3/2017 Facebook Thermal simulation result update
OCP_Mezz_thermal_model_v3_20171103 v3 11/3/2017 Facebook Thermal simulation model package
HPE_Comments_on_OCP_Mezz_v3_20170816 N/A 8/16/2017 HPE Presentation from HPE on 8/16/2017 call
Dell EMC - OCP NIC Presntation v1_20170906 v1 9/6/2017 Dell-EMC Presentation from Dell-EMC on 9/6/2017 call
Lenovo OCP Mezz3.0 Recommendations - 20170901 N/A 9/1/2017 Lenovo A mechanical focused presentation from Lenovo on 9/6/2017 call
9/25/2017 Workshop decks N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop slides from multiple contributors
9/25/2017 Workshop recording (large file 908MB) N/A 9/25/2017 Microsoft / TE / Amphenol / Broadcom / Intel / Facebook 9/25/2017 workshop recording from multiple contributors

Updates

1/19/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v63_20180119e_TN


1/18/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v62_20180118f_TN


1/16/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v60_20180116e_TN


1/15/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v57_20180109c_TN


1/2/2018 update

1. Update spec draft to OCP_NIC_3.0_draft_0v50_20171222i_TN

2. Move updates before 12/1/2017 to archive


12/20/2017 update

1. Updated spec draft, overview deck, and mechanical deck


12/5/2017 update

1. Update spec draft to OCP_NIC_3.0_draft_0v01_20171205c_TN

2. Update pin out to OCP 3.0 Pinout Proposal 20171205a_TN

3. Specification draft complete rate (Estimation)

Chapter Draft complete rate Status
1. Overview 70% drafted finishing up / under review
2. Card form factor 60+% drafted finishing up / under review
3. Card Edge and baseboard interface 80+ % drafted Under review
4. Management 0% drafted Need to work on
5. Data Network requirement TBD Same content as Mezz 2.0; check for need to keep this chapter
6. Card routing guideline and SI consideration TBD NC-SI specified on card; PCIe TBD
7. Thermal and Environmental TBD Need edit based on Mezz 2.0

4. Key mechanical updates:

- Agreed on guiding feature and card sizes

- Reduce to 2x sizes (Small and Large form factors; detail see latest spec draft)

To be closed:

- Front bracket / latching mechanism design for small and large form factors

- Right Angle connector vertical offset(3.05mm vs. 3.50mm); Need to decide and close based on Tolerance analysis

- Straddle Mount connector offset and PCB footprint; Need to decide and close based on 1U use case study


5. Coming working sessions and proposal of agenda:

-#7 12/6 : 2hr working session; ME and EE runs in parallel; close on ME opens and clarify the rest of draft work

-#8 12/13: 3-4hr: All draft work due for 1st pass of edit of all chapters. 1st cross review with changes suggested and agreed

-#9 12/20: 3-4hr: Review changes and post 1st draft




Find Archive of updates here

Find archive of mailing-list here


Meetings

This project meets - 2 times a Month; Defaults to 1st and 3rd Wednesday of the Month.

Call-in info and source of truth @ http://opencompute.org/projects/projects-calendar/ (Time zone shown: Eastern Time)

This call is open to the public.

If there is a cancellation, we will try our best to cancel >24hrs before the meeting by the calendars above.

Meeting minutes is sent out in mailing list and can be found at archive

Recordings from Past Calls

- April 18th, 2018
- April 4th, 2018

Events

2017/3/9

OCP Engineering Workshop Sessions https://ocpussummit2017.sched.com/event/9SAa/ocp-mezzanine-nic-20-and-beyond

More information about OCP events can be found at: http://www.opencompute.org/community/events/ocp-events-calendar


Communication

- Project communication is done through the opencompute-mezz-card mailing list.

- Please make sure following the steps until you receive confirmation email and welcome email from Opencompute-mezz-card@lists.opencompute.org.

Please check your junk box and unblock Opencompute-mezz-card@lists.opencompute.org if you have trouble getting confirmation email.

- To access the mailing list archives go to: http://lists.opencompute.org/pipermail/opencompute-mezz-card/

- For general discussion, please use mailing-list above by default; This is public domain and all discussion is archived

- Reach to Jia Ning if there is strong reason not to have public discussion

Specifications and Designs

All these accepted by the IC

Specification Version Submit Date Contributor License Notes
OCP Mezzanine card v2.0

OCP_Mezz_2.0_rev1.00_20151215b_pub_release.pdf(2.2MB)

OCP_Mezz_2.0_rev1.00_20151215b_pub_release_3D_package.zip (88MB)

Mechanical 20151023_P1-P9_K1-K5 zip file (57MB)

V2.0-1.0 Dec 15, 2015 Facebook OWFa 1.0 Added support for x16 (quad x4), NCSI, dual QSFP+, & Quad SDP+

Accepted by OCP IC 2/24/2016

OCP Mezzanine card v0.5, original standard

Mezzanine Card (rev 0.5)

V0.5 Oct 8, 2012 Facebook OWFa 1.0 Defacto standard for the original network mezzanine with a x8 PCIe Gen3 interface