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[[File:OCP-servers-v1-17a3x.png|right]] | |||
==Welcome== | |||
Welcome to the OCP DC-MHS Sub-Project. | |||
DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks. | |||
DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms. | |||
There are six workstreams that comprise DC-MHS. The objectives of the six workstreams are the following: | |||
*M-FLW (FulL Width HPM) | |||
**Specify the requirements of a Full Width Host Processor Module (HPM). This is for use within products designed for minimum 19" rack, also known as compliant with EIA-310-E but can also accommodate larger 21" racks. This form factor enables a full width HPM usage for CPUs, DIMMs, and related features. | |||
DC-MHS | *M-DNO (DeNsity Optimized HPM) | ||
**Outline the requirements of a family of partial width, DeNsity Optimized Host Processor Module (HPM) form factors within the OCP Modular 240 hardware system group of specifications (M-DNO for short). This M-DNO specification embodies design considerations for CPU, DIMMs, and other server processor related features commonly used by the industry today but is not limited to only those functions. | |||
*M-XIO/PESTI ( (eXtended I/O Connectivity/PEripheral SideBand Tunneling Interface) : | |||
**Outline the Modular Extensible I/O (M-XIO) source connector hardware strategy. An M-XIO source connector enables entry and exit points between sources such as Motherboards, Host Processor Modules & RAID Controllers, and peripheral subsystems such as PCIe risers, backplanes, etc. M-XIO includes the connector, high speed and management signal interface details and supported pinouts. Additionally, the workstream defines Interface (M-PESTI) base requirements for electrical and protocol compatibility between components of a DC-MHS platform. The M-PESTI protocol overloads a common PRSNT# signal with additional capabilities beyond simple presence/absence of a peripheral. | |||
*M-PIC (Platform Infrastructure Connectivity) | |||
**Defines and standardizes common elements needed to interface a Host Processor Module (HPM) to the platform/chassis infrastructure elements/subsystems within the DC-MHS 1.0 family of OCP servers. Standardization of the common interfaces and connectors enables hardware compatibility between DC-MHS HPMs and various DC-MHS system components. | |||
*M-CRPS (Common Redundant Power Supply) | |||
**Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that the customers and vendors of Enterprise and Hyperscale can use for their products. | |||
*M-SIF (Shared InFrastructure) | |||
**Improve interoperability related to shared infrastructure enclosures with multiple, serviceable modules. Modules containing elements (HPMs, DC-SCM, peripherals, etc.) are blind-matable and hot-pluggable into a shared infrastructure enclosure. | |||
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page. If you have any questions please contact OCP. | |||
==Project Leadership== | |||
=== | ===Sub-Project Leads=== | ||
*[mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel) | |||
*[mailto:shawn.dube@dell.com Shawn Dube] (Dell) | |||
===Workstream Leads=== | |||
*M-FLW: [mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel) and [mailto:corey.hartman@dell.com Corey Hartman] (Dell) | |||
*M-DNO: [mailto:dirk.blevins@intel.com Dirk Blevins] (Intel) and [mailto:michael.gregoire@dell.com Mike Gregoire] (Dell) | |||
*M-XIO/PESTI: [mailto:charlie.ziegler@dell.com Charlie Ziegler] (Dell) and [mailto:javier.lasa@intel.com Javier Lasa] (Intel) | |||
*M-PIC: [mailto:tim.lambert@dell.com Tim Lambert] (Dell) and [mailto:clifford.h.dubay@intel.com Cliff DuBay] (Intel) | |||
*M-CRPS: [mailto:aurelio.rodriguez.echevarria@intel.com Aurelio Rodriguez Echevarria] (Intel) and [mailto:jon.lewis@dell.com Jon Lewis] (Dell) | |||
*M-SIF: [mailto:dirk.blevins@intel.com Dirk Blevins] (Intel) and [mailto:gregory.sellman@amd.com Greg Sellman] (AMD) | |||
===Incubation Committee Representative=== | |||
*[mailto:tavallaei@google.com Siamak Tavallaei] (Google) | |||
* | |||
=== | ===DC-MHS Wiki Administrator=== | ||
*[mailto:john.a.dinsmoor@intel.com John Dinsmoor] (Intel) | |||
== | ==Current Status== | ||
DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022. | |||
DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. ''Note: M-SIF is a workstream new to DC-MHS. M-SIF is working on v1.0 specification.'' | |||
===Latest Base Specifications=== | |||
{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | {| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | ||
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! | ! Type !! Description !! Version !! Submit Date !! Contributor !! License !! Notes | ||
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| | | Specification || DC-MHS v1.0 specifications:<br />[http://files.opencompute.org/oc/public.php?service=files&t=c31e62bd9c9c376cf12d0a32956edd33 M-FLW_R1_v1p0]<br />[http://files.opencompute.org/oc/public.php?service=files&t=72e84d7b3d3ab2ebe8f4527a5157cd94 M-DNO_R1_v1p0]<br />[http://files.opencompute.org/oc/public.php?service=files&t=d407bb3e8e8bbf9f82985c6d56bb23b8 M-XIO_R1_v1p0]<br />[http://files.opencompute.org/oc/public.php?service=files&t=1c9ee4762fe3a7318bf26a4d18cac470 M-PIC_R1_v1p0]<br />[http://files.opencompute.org/oc/public.php?service=files&t=bf2e242598f9f5a9d0dcd899849e5608 M-CRPS_R1_v1p0]<br />[http://files.opencompute.org/oc/public.php?service=files&t=a9ae206f4ae5feb09f978f49ef581a62 M-PESTI_R1_v1p0] || R1-v1.0_RC || 9/28/2022 || DC-MHS CLA group || OWF || Reviewed in Oct meeting. Approved by the IC on 11/4/2022<br /><br />Final specifications are in the [https://www.opencompute.org/contributions?query=DC-MHS Contribution Database] | ||
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=== | ===Active Documents=== | ||
Documents and information on sub-groups are in the Wiki links above. Documents from the main Server group are below. | |||
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==Get Involved== | ==Get Involved== | ||
*[mailto:dcmhs@opencompute.org Mailing List] | *[mailto:dcmhs@opencompute.org Mailing List] | ||
*[https://www.opencompute.org/projects/server OCP | *[https://www.opencompute.org/projects/server OCP Calendar] | ||
==Communication== | ==Communication== | ||
*Project communication is done through [https://ocp-all.groups.io/g/OCP-MHS https://ocp-all.groups.io/g/OCP-MHS] | *Project communication is done through [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS] | ||
*Post: [mailto: | *Post: [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io] | ||
*Subscribe: [mailto: | *Subscribe: [mailto:OCP-DC-MHS+subscribe@OCP-All.groups.io OCP-DC-MHS+subscribe@OCP-All.groups.io] | ||
*Unsubscribe: [mailto: | *Unsubscribe: [mailto:OCP-DC-MHS+unsubscribe@OCP-All.groups.io OCP-DC-MHS+unsubscribe@OCP-All.groups.io] | ||
*''Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from [mailto: | *''Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io]'' | ||
*''Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email'' | *''Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email'' | ||
*To access the mailing list archives go to [https://ocp-all.groups.io/g/ | *To access the mailing list archives go to [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS] | ||
==Meeting Schedule== | ==Meeting Schedule== | ||
For monthly public meetings: | For monthly public meetings: | ||
*Schedule is | *Schedule is TBD | ||
*Each workstream has its own weekly meeting for companies that have signed the MHS R1 CLA. | *Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA. | ||
==Recordings from Past Monthly Meeting Calls== | ==Recordings from Past Monthly Meeting Calls== | ||
*TBD | |||
==Slides | ==Slides from April 2022 OCP Tech Talks== | ||
{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | {| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | ||
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! | ! Presenters (Company) !! Title !! Video !! Slides | ||
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| | | Shawn Dube (Dell), Brian Aspnes (Intel) || DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/e98e04e8ce8f9f0078d2cd7c745b6e98f1238f67.pdf Slides] | ||
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|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Corey Hartman (Dell), Brian Aspnes (Intel) || DC-MHS: FulL Width HPMs (M-FLW) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/d13d08ff84261b0e615f309507ccedb457cf2180.pdf Slides] | ||
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|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Mike Gregoire (Dell), Dirk Blevins (Intel) || DC-MHS: DeNsity Optimized HPMs (M-DNO) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/748b3531aaa728a59bdab6372c6d234c7989d894.pdf Slides] | ||
|| DC-MHS - | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| Tim Lambert (Dell) | | Cliff DuBay (Intel), Tim Lambert (Dell) || DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/522e38defb48eed767321515e27f5492c54f4071.pdf Slides] | ||
|| DC-MHS | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Charlie Ziegler (Dell), Javier Lasa (Intel) || DC-MHS: eXtensible I/O (M-XIO) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/6f2310a616532099b19677b52ba594312cb5059f.pdf Slides] | ||
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|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Tim Lambert (Dell), Javier Lasa (Intel) || DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/19a4b08cbe94c96c55a81a8138841768765d5a32.pdf Slides] | ||
|| DC-MHS | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Aurelio Rodriguez (Intel), Jon Lewis (Dell) || DC-MHS: Common Redundant Power Supply (M-CRPS) || [https://www.youtube.com/watch?v=Vy1h5sXVmQA Video] || [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/7dcd4a42fafc61adf22802577208a2404dd1c175.pdf Slides] | ||
|| DC-MHS | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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! Presenter | ! Presenter !! Title !! Video !! Slides | ||
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| | | Michael Leung (Google) | Aurelio Rodriguez Echevarria (Intel Corporation) | Corey Hartman (Dell) | Tim Lambert (Dell Inc.) | Eduardo Estrada (Intel Corporation) || PANEL: DC-MHS R1 report-out and timeline || [https://www.youtube.com/watch?v=-6gmxZiKvEI Video] || [https://drive.google.com/file/d/1ULofl4GqkfYI6bT73v55ureIPLBTvoNJ/view?usp=sharing Slides] | ||
|| DC-MHS | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Siamak Tavallaei (Google) | Brian Aspnes (Intel Corporation) | Shawn Dube (Dell) | Jean-Marie Verdun (HPE) | Dharmesh Jani (Meta) || PANEL: Datacenter Modular Hardware System (DC-MHS) || [https://www.youtube.com/watch?v=HdGQsbUqKow Video] || [https://drive.google.com/file/d/1XiM59aLnK9A8PP7W2gFfG7SQeuPZBlIz/view?usp=sharing Slides] | ||
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|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Dirk Blevins (Intel Corporation) | Todd Westhauser (Meta) | Vincent Nguyen (HPE) || Practical Usage of DC-MHS M-DNO Concepts || [https://www.youtube.com/watch?v=2qLueMd6n4A Video] || [https://drive.google.com/file/d/1PiSaLUQjrqoMdrznDWIMbGqB4xRA_xy_/view?usp=sharing Slides] | ||
|| DC-MHS | |||
|| [https://www.youtube.com/watch?v= | |||
|| [https:// | |||
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| | | Siamak Tavallaei (Google) | Dirk Blevins (Intel Corporation) || Multi-host Modular Systems || [https://www.youtube.com/watch?v=0HHNIni0_H0 Video] || [https://drive.google.com/file/d/1-I4SifOo4J53uBRPTNi_lsiqxIkQwuNy/view?usp=sharing Slides] | ||
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|| [https://www.youtube.com/watch?v= | |||
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The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral | The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral | ||
*[ | *[http://www.opencompute.org/contributions http://www.opencompute.org/contributions] | ||
or the OCP Marketplace, Orderable Products | or the OCP Marketplace, Orderable Products | ||
*[ | *[http://www.opencompute.org/products http://www.opencompute.org/products] | ||
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents. | Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents. | ||
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! Type !! Description !! Version !! Submit Date !! Contributor !! License !! Notes | ! Type !! Description !! Version !! Submit Date !! Contributor !! License !! Notes | ||
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