Editing Server/MHS

[[File:OCP-Open-compute-DC-MHS-icon-3x.png|right]]

==Welcome==

Welcome to the OCP Data Center – Modular Hardware System (DC-MHS) Sub-Project.

DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.

DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.

There are six workstreams that comprise DC-MHS. The objectives of the six workstreams are the following:

*M-HPM (Host Processor Modules) Workstream which involves three specifications:
**M-FLW (FulL Width HPM)
***Specify the requirements of a Full Width Host Processor Module (HPM). This is for use within products designed for minimum 19” rack, also known as compliant with EIA-310-E but can also accommodate larger 21” racks. This form factor enables a full width HPM usage for CPUs, DIMMs, and related features.
**M-DNO (DeNsity Optimized HPM)
***Outline the requirements of a family of partial width, DeNsity Optimized Host Processor Module (HPM) form factors within the OCP Modular 240 hardware system group of specifications (M-DNO for short). This M-DNO specification embodies design considerations for CPU, DIMMs, and other server processor related features commonly used by the industry today but is not limited to only those functions.
**M-SDNO (Modular Hardware System Scalable DeNsity Optimized Specification)
***Builds upon M-DNO, defines partial and full width HPMs with variable board outlines covering 19” EIA-310 and 21” OpenRack v3 infrastructure.
*M-XIO/PESTI (eXtended I/O Connectivity/PEripheral SideBand Tunneling Interface)
**Outline the Modular Extensible I/O (M-XIO) source connector hardware strategy. An M-XIO source connector enables entry and exit points between sources such as Motherboards, Host Processor Modules & RAID Controllers, and peripheral subsystems such as PCIe risers, backplanes, etc. M-XIO includes the connector, high speed and management signal interface details and supported pinouts. Additionally, the workstream defines Interface (M-PESTI) base requirements for electrical and protocol compatibility between components of a DC-MHS platform. The M-PESTI protocol overloads a common PRSNT# signal with additional capabilities beyond simple presence/absence of a peripheral.
*M-PIC (Platform Infrastructure Connectivity)
**Defines and standardizes common elements needed to interface a Host Processor Module (HPM) to the platform/chassis infrastructure elements/subsystems within the DC-MHS 1.0 family of OCP servers. Standardization of the common interfaces and connectors enables hardware compatibility between DC-MHS HPMs and various DC-MHS system components.
*M-CRPS (Common Redundant Power Supply)
**Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that the customers and vendors of Enterprise and Hyperscale can use for their products.
*M-SIF (Shared InFrastructure)
**Improve interoperability related to shared infrastructure enclosures with multiple, serviceable modules. Modules containing elements (HPMs, DC-SCM, peripherals, etc.) are blind-matable and hot-pluggable into a shared infrastructure enclosure.
*M-PnP (Modular Plug and Play)
**To ease system firmware and platform enablement integration. Defines interoperability for DC-MHS supporting systems to require and use industry standard processes using accepted algorithms and protocols to discover, manage, secure and maintain systems based on DC-MHS ingredients.


Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the [http://www.opencompute.org/about/ocp-policies/ OCP Policies] page. If you have any questions please contact OCP.


==Latest News==

There were a number of DC-MHS Technical Talks and Experience Center Lightning Talks at the October 2023 OCP Global Summit in San Jose. The presentations and recordings are posted below.

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Presenter (Company) !! Title !! Recording !! Slides
|-
| Paul Artman (AMD)<br>Dirk Blevins (Intel)<br>Rob Nance (Jabil)
|| Design with DC-MHS
|| [https://www.youtube.com/watch?v=tF35xYNFcIA Video]
|| [https://drive.google.com/file/d/1P44OmctBl9QS_xKgXQOKAoXB8iB0H5yp/view?usp=drive_link Slides]
|-
| Dirk Blevins (Intel)<br>Shawn Dube (Dell)<br>Vincent Nguyen (HPE)
|| Edge-MHS – Bringing Modular Hardware System to the Edge
|| [https://www.youtube.com/watch?v=tiatPvB0kTA Video]
|| [https://drive.google.com/file/d/1ulhZW1rg0wLHTcM_U_aElt_vuQeZw9kP/view?usp=drive_link Slides]
|-
| Cliff DuBay (Intel)<br>Shawn Dube (Dell)
|| DC-MHS - 48V Support
|| [https://www.youtube.com/watch?v=PbmtSUS_VrY Video]
|| [https://drive.google.com/file/d/1b3Lep66gPOQF0iccXRriXFcWsiV9N5EM/view?usp=drive_link Slides]
|-
| Tim Lambert (Dell)<br>Javier Lasa (Intel)<br>Phillip Leech (HPE)
|| DC-MHS's Road to Off-the-shelf/Interchangeable HPMs
|| [https://www.youtube.com/watch?v=MtpGeSnjjqg Video]
|| [https://drive.google.com/file/d/16yKSuVz6R7alS7_3vo7TYulVhHL4MsgL/view?usp=drive_link Slides]
|-
| Michael Gregoire (Dell)<br>Brian Aspnes (Intel)<br>Corey Hartman (Dell)<br>Matt Bowman (Meta)<br>Andrew Junkins (AMD)
|| Panel - DC-MHS: Updates and New Form Factors from the M-HPM Team
|| [https://www.youtube.com/watch?v=Y3XpGSI6q8Y Video]
|| [https://drive.google.com/file/d/17efYJgbEatWiZS00Ba9S1tlq87Kj62_T/view?usp=drive_link Slides]
|-
| Gregory D Sellman (AMD)<br>Dirk Blevins (Intel)<br>Damien Chong (Meta)
|| DC-MHS Modular Shared Infrastructure (M-SIF) - Comprehending Multi-Node/Host
|| [https://www.youtube.com/watch?v=dWHF6-88Rh8 Video]
|| [https://drive.google.com/file/d/1CeP6nnnA9dRHFEsd22UZQGBAgqYT7NIu/view?usp=drive_link Slides]
|-
| Tim Lambert (Dell)<br>Mike Witkowski (HPE)<br>Todd Rosedahl (IBM)<br>Javier Lasa (Intel)
|| DC-MHS: Peripheral Out-of-Band Management Evolution
|| [https://www.youtube.com/watch?v=LF_8JZ1UKAs Video]
|| [https://drive.google.com/file/d/15HI6QgYAcsrrYav1oWO0Z67OL2s5pEJh/view?usp=drive_link Slides]
|-
| Jeff Kennedy (Dell)<br>Javier Lasa (Intel)<br>Eduardo Estrada (Intel)
|| DC-MHS, M-PESTI: What, Why and When to Use It.
|| [https://www.youtube.com/watch?v=X4WUI2kifdI Video]
|| [https://drive.google.com/file/d/1URTFmr6COYueVBcEzfuxig84w7bMx_1H/view?usp=drive_link Slides]
|-
| Aurelio Rodriguez Echevarria (Intel)
|| DC-MHS: M-CRPS base specification and test setup updates
|| [https://www.youtube.com/watch?v=8in9VhnLkrw Video]
|| [https://drive.google.com/file/d/1C2kcC-kDv5q4-oiAum38Nd8fPtO9Qg8t/view?usp=drive_link Slides]
|-
| Chitrak Gupta (AMI)<br>Justin Thaler (Jabil)
|| Enabling DC-MHS Design for Future Datacenters with Dynamic Firmware
|| [https://www.youtube.com/watch?v=98ZuB9FgotM Video]
|| [https://drive.google.com/file/d/13tG54UNQjiojV3ncMkXiML72Mv2shhrJ/view?usp=drive_link Slides]
|-
| Munir Ahmad (Lattice)<br>Lawrence Lo (Intel)<br>Raghu Kondapalli (Axiado)
|| Driving DC-SCM innovations and interoperability - presented by DC-MHS
|| [https://www.youtube.com/watch?v=U_ttxtNY6C4 Video]
|| [https://drive.google.com/file/d/1NkQIUC2FUbyV9PspiHZbgGwxj_K0pE3P/view?usp=drive_link Slides]
|-
|| Richard Caubang (Advanced Energy)<br>Austen Cook (Jabil)<br>Rob Nance (Jabil)<br>Aurelio Rodriguez Echevarria (Intel)
|| Cross Vendor Interoperability in Server Design and M-CRPS/Test board Demonstration Speakers - presented by DC-MHS
|| [https://www.youtube.com/watch?v=Qr6rb5_b4NA Video]
|| [https://drive.google.com/file/d/1iI-91bOFzT9ozsfpyTpKWpxrcpGDCafH/view?usp=drive_link Slides]
|}

==Project Leadership==


===Sub-Project Leads===
*[mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel)
*[mailto:shawn.dube@dell.com Shawn Dube] (Dell)


===Spec. Authors===
*M-FLW:  [mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel) and [mailto:corey.hartman@dell.com Corey Hartman] (Dell)
*M-DNO: [mailto:dirk.blevins@intel.com Dirk Blevins] (Intel) and [mailto:michael.gregoire@dell.com Michael Gregoire] (Dell)
*M-XIO/PESTI:  [mailto:charlie.ziegler@dell.com Charlie Ziegler] (Dell) and [mailto:javier.lasa@intel.com Javier Lasa] (Intel) 
*M-PIC:  [mailto:tim.lambert@dell.com Tim Lambert] (Dell) and [mailto:clifford.h.dubay@intel.com Cliff DuBay] (Intel) 
*M-CRPS:  [mailto:aurelio.rodriguez.echevarria@intel.com Aurelio Rodriguez Echevarria] (Intel) and [mailto:jon.lewis@dell.com Jon Lewis] (Dell)
*M-SIF:  [mailto:dirk.blevins@intel.com Dirk Blevins] (Intel) and [mailto:gregory.sellman@amd.com Greg Sellman] (AMD)
*M-SDNO:  [mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel), [mailto:michael.gregoire@dell.com Michael Gregoire] (Dell), [mailto:corey.hartman@dell.com Corey Hartman] (Dell), and [mailto:andrew.junkins@amd.com Andy Junkins] (AMD)
*M-PnP: [mailto:tim.lambert@dell.com Tim Lambert] (Dell) and [mailto:phillip.leech@hpe.com Phil Leech] (HPE)


===DC-MHS Wiki Administrator===
*[mailto:john.a.dinsmoor@intel.com John Dinsmoor] (Intel)

==Current Status==

DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.

DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications.  Note:  M-SIF is a workstream new to DC-MHS.  An early version of the M-SIF specification (version 0.5) is included in the Latest DC-MHS Specification section.

A link to a Readme file explaining how to use the following tables (Latest DC-MHS Specifications, Errata and Supporting Documentation, and Inactive Documents) is here:  [https://docs.google.com/presentation/d/1CyVsLCPpkJb0FV_ZOYjWndqE4AHATdh-/edit?usp=share_link&ouid=107990764505043211297&rtpof=true&sd=true Link]


===Latest Released DC-MHS Specifications===

Note:  The Final Spec Agreement (FSA) for the latest specs has not yet been signed.  You may access the released versions in the Contribution Database ([https://www.opencompute.org/contributions?query=DC-MHS Contribution Database]).

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Type !! Description !! Version !! Submit Date !! Contributor !! style="min-width:100px;"| Link !! Notes
|-
| Specification
|| M-SDNO Base Specification
|| 0.7 RC3
|| 1/29/2024
|| Brian Aspnes
|| [https://drive.google.com/file/d/1obyJXN5zDATVEsaMi_aduoFxQsa6Gzf4/view?usp=drive_link 0.7 Link]
|| Added detail on Class A/B/C/D HPMs.  Fixed typos and drawing numbers.
|-
| Specification
|| M-CRPS Base Specification
|| 1.03 RC2
|| 12/15/23
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/file/d/1-NDJ2bq-xiWrxVvanxt9uA4Q7OfphwhY/view?usp=drive_link 1.03 RC2 Link]
[https://drive.google.com/file/d/1ErNoBnIhlriR7gHBR6SBPyOgqAv6ASBc/view?usp=drive_link Mech Dwg]
|| Update:
*Multiple updates to many sections
*Updated pictures and figures
*Fixed typos
|-
| Specification
|| M-XIO Base Specification
|| 1.03
|| 11/21/23
|| Javier Lasa
|| [https://drive.google.com/file/d/1Awa3AjaGwgr4tY9aZZJCqnPHAN4o69Sk/view?usp=drive_link 1.03 Link (non CB Version)]
[https://drive.google.com/file/d/159tpefsdjDxQl6xljy-ZA_V6Wy365a-0/view?usp=drive_link 1.03 Link (CB version)]
|| Updates:
*Version 1.03 of the specification with and without change bar.
*Changed pull-up from 127Kohm to 100Kohm on FLEXIO / CBL_PRES_PESTI_N topologies.
|-
| Specification
|| M-SIF Base Specification
|| 0.5
|| 10/2/2023
|| Greg Sellman
|| [https://drive.google.com/file/d/1XydP-ZXhKFRANi6Wuhtkp7TVAfkKKRCZ/view?usp=drive_link 0.5 Link (non CB Version)]
[https://drive.google.com/file/d/1oiK13rE4i1sBsobHv1aWAffGIen5a1X4/view?usp=drive_link 0.5 Link (CB version)]
|| Updates to high-speed IO & management interfaces. Connectors defined.
|-
| Specification
|| M-SDNO Base Specification
|| 0.5
|| 10/2/2023
|| Brian Aspnes
|| [https://drive.google.com/file/d/1knfzOzEaBEFQ2PnkikmT_P5IlnUefwrC/view?usp=drive_link 0.5 Link]
|| Replaces the (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2.pdf specification.
|-
| Specification 
|| M-PIC Base Specification 
|| 1.03 
|| 9/28/2023 
|| Cliff DuBay 
|| [https://drive.google.com/file/d/1bIsjQoUAiK4oVtwBkSNTldoJAIC1LpI3/view?usp=drive_link 1.03 Link (non CB Version)]<br>
[https://drive.google.com/file/d/13Vh0dFjW88jCZozOGR0XmAJ4674BC5hr/view?usp=drive_link 1.03 Link (CB version)] 
|| Updates:
*SGPIO and PDB Management RFU
*Cable Optimized boot connector rating & power control
*I3C recommendations
*SB - signal termination
|-
| Specification
|| M-DNO Base Specification
|| 1.01 RC2
|| 7/20/2023
|| Mike Gregoire
|| [https://drive.google.com/file/d/1CKY8mDWPAh4oDrJETX-KkbiB9LJVoTAe/view?usp=drive_link 1.01 RC2 Link (non CB Version)]<br>[https://drive.google.com/file/d/177Dsa-76x246txEPcyPvj4Erq2jsxyod/view?usp=drive_link 1.01 RC2 Link (CB version)]
|| Updates:
*Updated tables, link1.01 RC2 Link (non CB Versions, pictures
|-
| Specification
|| M-PESTI Base Specification
|| 1.1 RC5
|| 7/18/2023
|| Jeff Kennedy
|| [https://drive.google.com/file/d/1hnOL2afwPmXMyK99ljcBcCwqK_1bMZD4/view?usp=drive_link 1.1 RC5 Link (no change bar)]<br>[https://drive.google.com/file/d/1KIR9rJocHDXlJDDKsJanxMosnbyCxpRY/view?usp=drive_link 1.1 RC5 Link (CB Version)]
|| Updates:
*BAUD accuracy tolerance changed to +/-2%.
*Overall clarification on the spec, general clean up.
*Simplified payload headers and source to destination discovery examples.
*See specification for detailed updates.
|-
| Specification
|| M-FLW Base Specification
|| v1.01 RC2
|| 6/1/2023
|| Brian Aspnes
|| [https://drive.google.com/file/d/1xmUP0tMXLyHLYNhPwTmUvEaFyTK-oPqj/view?usp=drive_link 1.01 RC2 Link]<br>[https://drive.google.com/file/d/1Y7vwjZ58c4XrWGqw7mmbGSWxuwjVuBP6/view?usp=drive_link 1.01 RC2 Link (CB Version)]
|| 
*Fixes for date mismatches and Figure numbers.
*Change bar version
|}

===Latest Released DC-MHS MCAD===

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Spec. Impacted !! Name !! Format !! Version !! Submit Date !! Contributor !! Link !! Notes
|-
| SDNO
|| M-SDNO Class “A” Zip CAD Files Rev 0.7
|| STP
|| CAD
|| 1/22/24
|| Brian Aspnes
|| [https://drive.google.com/file/d/1YK6dtS7hfkoRNrOTrXJRE0VsqW3xeBiz/view?usp=drive_link Link]
|| Includes A305, A335, and A555.
|-
| SDNO
|| M-SDNO Class “B” Zip CAD Files Rev 0.7
|| STP
|| CAD
|| 1/22/24
|| Brian Aspnes
|| [https://drive.google.com/file/d/1Lcxi2ek6lwPF4L4AoLH5ENmUjqerhs09/view?usp=drive_link Link]
|| Includes B305, B335, and B555.
|-
| SDNO
|| M-SDNO Class “C” Zip CAD Files Rev 0.7
|| STP
|| CAD
|| 1/22/24
|| Brian Aspnes
|| [https://drive.google.com/file/d/1gXnDVPRMuXOKsCsW6TjHRCG_2RvDti7R/view?usp=drive_link Link]
|| Includes C305, C335, and C555.
|-
| SDNO
|| M-SDNO Class “D” Zip CAD Files Rev 0.7
|| STP
|| CAD
|| 1/22/24
|| Brian Aspnes
|| [https://drive.google.com/file/d/1bB_Jk939M0OZpMj9ePU82H68_ea_sjNu/view?usp=drive_link Link]
|| Includes D305, D335, and D555.
|-
| FLW
|| T1 FLW
|| STP
|| CAD
|| 5/23/2023
|| Brian Aspnes
|| [https://drive.google.com/file/d/16ZMUqJWoGE5SZ-iKAvZAybNZVoor5zLM/view?usp=drive_link Link]
|| &nbsp;
|-
| DNO
|| DNO Type 4 MCAD
|| STP
|| CAD
|| 2/15/23
|| Mike Gregoire
|| [https://drive.google.com/file/d/14qGvxn2yb_iIW25NvAWaxmJeY1mm0orJ/view?usp=drive_link DNO Type 4 Link]
|| Type 4 CAD
|-
| DNO
|| DNO Type 3 MCAD
|| STP
|| CAD
|| 10/26/22
|| Mike Gregoire
|| [https://drive.google.com/file/d/1KwNNY5aDE_D0qRqW3V-29n_vVyMT5s77/view?usp=drive_link Link]
|| Type 3 CAD Files
|-
| DNO
|| DNO Type 2 MCAD
|| STP
|| CAD
|| 10/26/22
|| Mike Gregoire
|| [https://drive.google.com/file/d/1K5K6Jx3eTGSqCjOwvBfuCg3Lbh0Qs1IE/view?usp=drive_link Link]
|| Type 2 CAD Files
|}

===DC-MHS Tools===

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Spec. Impacted !! Name !! Format !! Version !! Submit Date !! Contributor !! style="min-width:125px;"| Link !! Notes
|-
| CRPS
|| make_mcrps_config_file
|| Source Code
|| 1.0
|| 7/26/2023
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/drive/folders/1P3xTMK8sU_SXSGOf31iL6EpQ3nBpV-Wy Folder Link]<br>[https://drive.google.com/file/d/1ErNoBnIhlriR7gHBR6SBPyOgqAv6ASBc/view?usp=drive_link]
|| M-CRPS Configuration file make tool, use CodeBlocks and GCC to compile the project. First release it only generates a .bin file from the header and the configuration area.
|}


===Errata and Supporting Documentation===

This section includes Errata and ECNs that have not been moved into a public spec release yet (these files supersede anything in the current released specs).

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Spec. Impacted !! Name !! Format !! Version !! Submit Date !! Contributor !! Link !! Notes
|-
| PIC
|| Current Connector List
|| Document
|| 1
|| 2/1/2023
|| Cliff DuBay
|| [https://docs.google.com/spreadsheets/d/1Vq_JxzZ43ysxBNHJ928vnzIcshA95GYGocaKmJCBC80/edit?usp=share_link Link]
|| M-PIC Connector List
|}


===Inactive Documents===

This section includes Workstream specification errata and any other working documents.

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Spec Impacted !! Name !! Format !! Version !! Submit Date !! Contributor !! style="min-width:100px;"| Link !! Notes
|-
| SNDO
|| M-SDNO Base Specification
|| PDF
|| 0.5
|| 10/2/2023
|| Brian Aspnes
|| [https://drive.google.com/file/d/1knfzOzEaBEFQ2PnkikmT_P5IlnUefwrC/view?usp=drive_link 0.5 Link]
|| Replaces the (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2.pdf specification.
|-
| SDNO
|| M-SDNO Class “A” Zip CAD Files
|| STP
|| 0.5
|| 10/2/23
|| Brian Aspnes
|| [https://drive.google.com/file/d/1mXoZBWNi3bZmQ-TabuIY_5Ddz0VR-bw-/view?usp=drive_link Link]
|| Includes A305, A335, and A555.
|-
| SDNO
|| M-SDNO Class “B” Zip CAD Files
|| STP
|| 0.5
|| 10/2/23
|| Brian Aspnes
|| [https://drive.google.com/file/d/1xwR4cHkuRo5g7l7VrRAfnOIHHze1fc6b/view?usp=drive_link Link]
|| Includes B305, B335, and B555.
|-
| SDNO
|| M-SDNO Class “D” Zip CAD Files
|| STP
|| 0.5
|| 10/2/23
|| Brian Aspnes
|| [https://drive.google.com/file/d/1SQt9graR8BZC2beBFljTg-YPAMTXnOuQ/view?usp=drive_link Link]
|| Includes D305, D335, and D555.
|-
| CRPS
|| M-CRPS Base Specification
|| PDF
|| 1.02 RC2
|| 8/23/2023
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/file/d/1bhVL_XdduqiLCJB_D0tLynhOPv_1tT_9/view?usp=drive_link 1.02 RC2 Link]<br>
[https://drive.google.com/file/d/1uWUb1oxCnsd8voB4xLvJqcDNmuMujKgu/view?usp=drive_link 1.02 RC2 Mechanical Drawings]
|| Update:
*Multiple updates to many sections
*Updated pictures and figures
|-
| (Directional) M-DNO Types 5-7 0p3 RC2
|| Updated CAD Files for Type 7
|| STP
|| 1.0
|| 6/1/23
|| Andrew Junkins
|| [https://drive.google.com/file/d/1LhOi4WgXdm6WWViCzgCHzlIAPmN_OXSA/view?usp=drive_link Link]
|| Type 7 CAD Files - updated to match M-DNO v0.3 RC2 specification
|-
| (Directional) M-DNO Types 5-7 0p3 RC2
|| Updated CAD Files for Type 6
|| STP
|| 1.0
|| 5/16/23
|| Brian Aspnes
|| [https://drive.google.com/file/d/1ql33NOGWQbUcXz96ZjfHcMH3Gjcogv5d/view?usp=drive_link Link]
|| Type 6 CAD Files
|-
| (Directional) M-DNO Types 5-7 0p3 RC2
|| Updated CAD Files for Type 5
|| STP
|| 1.0
|| 5/16/23
|| Brian Aspnes
|| [https://drive.google.com/file/d/1KmtxRLk7OhZWZJW9RsrvcN80Edr-lecy/view?usp=drive_link Link]
|| Type 5 CAD Files
|-
| (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2
|| M-DNO Base Specification
|| PDF
|| v0.3 RC2
|| 5/16/23
|| Mike Gregoire
|| [https://drive.google.com/file/d/1MlVSquZywrB2Ht8sUjN9oKuhzRTB3Qk2/view?usp=drive_link 0.3 Link]
|| (Directional) M-DNO Specification Updates for HPM Types 5-7
|-
| SIF
|| M-SIF Base Specification
|| PDF
|| 0.3
|| 3/29/2023
|| Dirk Blevins
|| [https://drive.google.com/file/d/1Vz4n4rM4kYJPuW_WnjHzdH8HNcWl6voe/view?usp=share_link Link]
|| Early version (0.3) of the M-SIF specification
|-
| XIO
|| M-XIO Base Specification
|| PDF
|| 1.02
|| 3/16/2023
|| Javier Lasa
|| [https://drive.google.com/file/d/1LwFzpmi6nROouWC2Bw_Vz-JfJUK57Ae2/view?usp=share_link Version 1.02]<br>[https://drive.google.com/file/d/17ZpGByoswdDBp9Z8v3j0AA9lT7Ba_Y5S/view?usp=share_link Link]
|| Update:
*Version 1.02 of the Specification with the Change Bar.
*Added a compliance table.
|-
| PIC
|| M-PIC Base Specification
|| PDF
|| 1.02
|| 3/13/2023
|| Clifford DuBay
|| [https://drive.google.com/file/d/17Va-5lXufEZodzFWQOwEDPa0-pr5WSlS/view?usp=share_link Version 1.02]<br>[https://drive.google.com/file/d/1HdTkflKge0QI6maCi3svl0PIRYKpFO_X/view?usp=share_link Link]
|| Update:
*Version 1.02 of the Specification with the Change Bar.
*Improved compliance requirement visibility, clarified OR-ing requirement for +12V sources, & added contributors.
|-
| CRPS
|| M-CRPS Base Specification
|| PDF
|| 1.01 RC2
|| 7/26/2023
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/file/d/1zAL49A9970CZxXDfSWWHKmi8PyvYEhDG/view?usp=drive_link 1.01 RC2 Link]<br>[https://drive.google.com/file/d/1Vny_1d-e0IPqeJfheH_UlrXQL_BPkrAk/view?usp=drive_link 1.01 RC2 Mechanical Drawings]
|| Update:
*Integrated Errata
*Updated pictures and figures
|-
| CRPS
|| Errata
|| PDF
|| RC4 Rev 2
|| 4/25/23
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/file/d/11xGUx2Y1qKkcuwK4owVBix8py7_katcV/view?usp=share_link Link]
|| Corrections in Rev 1.0 RC4 of the M-CRPS specification.
|-
| CRPS
|| Errata
|| PDF
|| RC4 Rev 1
|| 4/3/2023
|| Aurelio Rodriguez Echevarria
|| [https://drive.google.com/file/d/1TbUu4meHdnnJZ3VtSiy7sON2URYX73kY/view?usp=share_link Link]
|| Fixes typos and drawing errors.
|-
| PIC
|| M-PIC Base Specification
|| PDF
|| 1.01
|| 2/3/2023
|| Clifford DuBay
|| [https://drive.google.com/file/d/1JTDvOGOuTnFZjFgp2Ae2lebFZZCmnArc/view?usp=share_link Version 1.01]<br>[https://drive.google.com/file/d/1d2LHGnvyiBcQVCc1_lTO6Xo1WWYi_2Ml/view?usp=share_link Change Bar]
|| 
*Version 1.01 of the Specification with the Change Bar.
*Update Figures and Tables, add Errata content, include Hot Plug information.
|-
| PIC
|| M-PIC Errata 1 and 2
|| PDF
|| 1.0
|| 2/1/2023
|| Clifford DuBay
|| [https://drive.google.com/file/d/13G_x8I4XgwV9m6fb38sI1k9zKxfISlQs/view?usp=share_link Link]
|| 
*Errata 1:  Update Section 9.1 to Avoid High Current in Partial-Mate Conditions
*Errata 2: Update Section 9.1.7.6 to increase the Power Rating from 1080W to 2000W.
|-
| XIO
|| M-XIO Base Specification
|| PDF
|| 1.01 RC1
|| 1/24/2023
|| Javier Lasa
|| [https://drive.google.com/file/d/1NFDrByIIVKE3YpOkHtfXi1FYPeEKxVnQ/view?usp=share_link Link]
|| Incorporated Errata #1. ECN: Addition of cable construction considerations, incorporated cable considerations (alignment with PCI-SIG internal cable spec), clarification on P3V3_MGMT usage.
|-
| XIO
|| Errata
|| PDF
|| 1.0
|| 12/12/2022
|| Javier Lasa
|| [https://drive.google.com/file/d/1a-9o3YmJcMONEz7uQpqaBw7l8q_OJE2l/view?usp=sharing Link]
|| Update SFF-TA-1016 and SFF-TA-1033 pinouts.
|-
| XIO
|| M-XIO Specification
|| PDF
|| 1.0 RC4
|| 9/28/2022
|| Javier Lasa
|| [https://www.opencompute.org/documents/m-xio-r1-v1p0-rc4-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|-
| PESTI
|| M-PESTI Specification
|| PDF
|| 1.0 RC2
|| 9/28/2022
|| Javier Lasa
|| [https://www.opencompute.org/documents/m-pesti-r1-v1p0-rc2-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|-
| DNO
|| M-DNO
|| PDF
|| 1.0 RC5
|| 9/28/22
|| Michael Gregoire
|| [https://www.opencompute.org/documents/m-dno-r1-v1p0-rc5-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|-
| FLW
|| M-FLW Specification
|| PDF
|| 1.0 RC5
|| 9/28/2022
|| Corey Hartman
|| [https://www.opencompute.org/documents/m-flw-r1-v1p0-rc5-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|-
| CRPS
|| M-CRPS Specification
|| PDF
|| 1.0 RC4
|| 9/28/22
|| Aurelio Rodriguez Echevarria
|| [https://www.opencompute.org/documents/m-crps-r1-v1p0-rc4-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|-
| PIC
|| M-PIC Specification
|| PDF
|| 1.0 RC7
|| 9/28/2022
|| Clifford DuBay
|| [https://www.opencompute.org/documents/m-pic-r1-v1p0-rc7-pdf Link]
|| Reviewed in Oct meeting. Approved by the IC on 11/4/2022
|}

==Get Involved==
*[mailto:dcmhs@opencompute.org Mailing List]
*[https://www.opencompute.org/projects/server OCP Server Project Calendar]


==Communication==
*Project communication is done through [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS]
*Post: [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io]
*Subscribe: [mailto:OCP-DC-MHS+subscribe@OCP-All.groups.io OCP-DC-MHS+subscribe@OCP-All.groups.io]
*Unsubscribe: [mailto:OCP-DC-MHS+unsubscribe@OCP-All.groups.io OCP-DC-MHS+unsubscribe@OCP-All.groups.io]
*''Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io]''
*''Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email''
*To access the mailing list archives go to [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS]


==Meeting Schedule==

For monthly public meetings:
*Schedule is the third Wednesday of every month at 0800 PST.
*Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.
*[https://www.opencompute.org/projects/dc-mhs OCP DC-MHS Project Calendar]


==Recordings from Past Monthly Meeting Calls==

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Presenter (Company) !! Title !! Recording !! Slides
|-
| DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman, Dirk Blevins)
|| January 2024 Public Call
|| [https://drive.google.com/file/d/1gCMNzgiKoI1oi1N4L9np8dId6Q_qLWGP/view?usp=drive_link Recording]
|| [https://docs.google.com/presentation/d/17lFHNW9Jn1m6sKj6NddHnLLWehTNMKfl/edit?usp=drive_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]
|-
| DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman)
|| September 2023 Public Call
|| [https://opencompute-org.zoom.us/rec/share/JYTzuAmuxq8no5wjlqhziI4ZJbhBiYrJi496d0iMy3m6EgVVc7JU8IDmZ_YJgrFT.gYurp8y9FMTuLFs0?pwd=hzl4KctkXQOSbmUSyY8RJPHd3CX8YcCY Recording]
|| [https://docs.google.com/presentation/d/11NbaSYqCpp5JSzETKGdIVI6O5BOUoMJn/edit?usp=drive_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]
|-
| DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman)
|| August 2023 Public Call
|| [https://drive.google.com/file/d/1f2G-wPxbUzF9CYmwiWW55OjmdjufmfU9/view?usp=drive_link Recording]
|| [https://docs.google.com/presentation/d/1AVykn8LTIV3yEAnrJ9YOR5M-BmkZTaM-/edit?usp=drive_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]
|-
| DC-MHS HPM Workstream Updates (Brian Aspnes, Mike Gregoire, Javier Lasa, Aurelio Rodriguez Echevarria, Greg Sellman)  Includes earlier OCP information on the Contribution Process for reference.
|| July 2023 Public Call
|| [https://drive.google.com/file/d/113BwD1qgC8LxZ_KjrEDdtYDI4h4Vp3io/view?usp=drive_link Recording]
|| [https://docs.google.com/presentation/d/1M80W1uVUUhSvOTQXzVnX7xo0gFiimoU4/edit?usp=drive_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]<br>[https://drive.google.com/file/d/1RCTSd8Tw5qXI1-tDRea5gaGA_Xq40qIh/view?usp=drive_link OCP Contribution Process]
|-
| DC-MHS HPM Workstream Updates (Brian Aspnes, Andy Junkins, Aurelio Rodriguez Echevarria)
|| June 2023 Public Call
|| [https://drive.google.com/file/d/1TsCkuiaoJ7qhWvlFONBeN6tdLk2MBUQW/view?usp=drive_link Recording]
|| [https://docs.google.com/presentation/d/1pbCRW7_lhNeoNCt9LjwUtzb8ziqEV7k5/edit?usp=drive_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]
|-
| DC-MHS HPM Workstream Updates and New Spec (Corey Hartman, Mike Gregoire, Aurelio Rodriguez Echevarria)
|| May 2023 Public Call HPM WS Update
|| [https://drive.google.com/file/d/1cVnNiP4rMqr8D0J6TkyvtB801_IUs7bS/view?usp=share_link Recording]
|| [https://drive.google.com/file/d/1rxJn1BUSmjwm0W89YouCRnleFxe0kRaZ/view?usp=share_link HPM WS Update]
[https://drive.google.com/file/d/1ld3Ew7-PrTmisZM85aJGpLKcb8M_tJfN/view?usp=share_link New HPM Spec]
|-
| DC-MHS HPM Workstream Update (Corey Hartman, Mike Gregoire) and Delta and Artesyn Representatives
|| April 2023 Public Call
|| [https://drive.google.com/file/d/1vdn8yE5YHHGRt-uCjD8lMUEghPcQvtpv/view?usp=share_link Recording]
|| [https://drive.google.com/file/d/1sI8byekDQvkL4jilFuJ1O_9T32sD56C2/view?usp=share_link HPM WS Update]<br>
[https://drive.google.com/file/d/1HruPfHrGBjJiNwZcxbA1_wtU4afra-1l/view?usp=share_link Artesyn Presentation]
|-
| DC-MHS Workstream and Subproject Leads
|| March 2023 Public Call
|| [https://drive.google.com/file/d/1HMjO4TsFTw04wltFQUaiUjsSsspvb_w3/view?usp=share_link Recording]
|| [https://docs.google.com/presentation/d/1PUfREdEHktxyDaP5mk85Ddvw-3Nn12Sd/edit?usp=share_link&ouid=107990764505043211297&rtpof=true&sd=true Slides]
|}

==Slides/Recordings from April 2023 OCP Regional Summit==

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Presenter (Company) !! Title !! Recording !! Slides
|-
| Dirk Blevins (Intel)<br>Paul Artman (AMD)<br>Rob Nance (Jabil)
|| Data Center Modular Hardware System (DC-MHS) Overview & Update
|| [https://www.youtube.com/watch?v=m7cotny5Cyw Video]
|| [https://drive.google.com/file/d/1Rc-P6MNF5qgysw7NsraKTmTO4MmrAQr3/view?usp=share_link Slides]
|}


==Slides/Recordings from October 2022 OCP Global Summit==

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Presenter (Company) !! Title !! Recording !! Slides
|-
| Michael Leung (Google)<br>Aurelio Rodriguez Echevarria (Intel)<br>Corey Hartman (Dell)<br>Tim Lambert (Dell)<br>Eduardo Estrada (Intel)
|| PANEL: DC-MHS R1 report-out and timeline
|| [https://www.youtube.com/watch?v=-6gmxZiKvEI Recording]
|| [https://drive.google.com/file/d/1ULofl4GqkfYI6bT73v55ureIPLBTvoNJ/view?usp=sharing Slides]
|-
| Siamak Tavallaei (Google)<br>Brian Aspnes (Intel)<br>Shawn Dube (Dell)<br>Jean-Marie Verdun (HPE)<br>Dharmesh Jani (Meta)
|| PANEL: Datacenter Modular Hardware System (DC-MHS)
|| [https://www.youtube.com/watch?v=HdGQsbUqKow Recording]
|| [https://drive.google.com/file/d/1XiM59aLnK9A8PP7W2gFfG7SQeuPZBlIz/view?usp=sharing Slides]
|-
| Dirk Blevins (Intel)<br>Todd Westhauser (Meta)<br>Vincent Nguyen (HPE)
|| Practical Usage of DC-MHS M-DNO Concepts
|| [https://www.youtube.com/watch?v=2qLueMd6n4A Recording]
|| [https://drive.google.com/file/d/1PiSaLUQjrqoMdrznDWIMbGqB4xRA_xy_/view?usp=sharing Slides]
|-
| Siamak Tavallaei (Google)<br>Dirk Blevins (Intel)
|| Multi-host Modular Systems (M-SIF)
|| [https://www.youtube.com/watch?v=0HHNIni0_H0 Recording]
|| [https://drive.google.com/file/d/1-I4SifOo4J53uBRPTNi_lsiqxIkQwuNy/view?usp=sharing Slides]
|}


==Slides/Recordings from April 2022 OCP Tech Talks==

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Presenter (Company) !! Title !! Recording !! Slides
|-
| Shawn Dube (Dell)<br>Brian Aspnes (Intel)
|| DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/e98e04e8ce8f9f0078d2cd7c745b6e98f1238f67.pdf Slides]
|-
| Corey Hartman (Dell)<br>Brian Aspnes (Intel)
|| DC-MHS: FulL Width HPMs (M-FLW)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/d13d08ff84261b0e615f309507ccedb457cf2180.pdf Slides]
|-
| Mike Gregoire (Dell)<br>Dirk Blevins (Intel)
|| DC-MHS: DeNsity Optimized HPMs (M-DNO)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/748b3531aaa728a59bdab6372c6d234c7989d894.pdf Slides]
|-
| Cliff DuBay (Intel)<br>Tim Lambert (Dell)
|| DC-MHS: Peripheral Infrastructure Connectivity (M-PIC)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/522e38defb48eed767321515e27f5492c54f4071.pdf Slides]
|-
| Charlie Ziegler (Dell)<br>Javier Lasa (Intel)
|| DC-MHS: eXtensible I/O (M-XIO)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/6f2310a616532099b19677b52ba594312cb5059f.pdf Slides]
|-
| Tim Lambert (Dell)<br>Javier Lasa (Intel)
|| DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/19a4b08cbe94c96c55a81a8138841768765d5a32.pdf Slides]
|-
| Aurelio Rodriguez (Intel)<br>Jon Lewis (Dell)
|| DC-MHS: Common Redundant Power Supply (M-CRPS)
|| [https://www.youtube.com/watch?v=Vy1h5sXVmQA Recording]
|| [https://146a55aca6f00848c565-a7635525d40ac1c70300198708936b4e.ssl.cf1.rackcdn.com/images/7dcd4a42fafc61adf22802577208a2404dd1c175.pdf Slides]
|}


==OCP Marketplace Entries==

The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral
*[http://www.opencompute.org/contributions http://www.opencompute.org/contributions]
or the OCP Marketplace, Orderable Products
*[http://www.opencompute.org/products http://www.opencompute.org/products]
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.

{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;"
|-
! Type !! Description !! Version !! Submit Date !! Contributor !! License !! Notes
|-
| &nbsp;
|| &nbsp;
|| &nbsp;
|| &nbsp;
|| &nbsp;
|| &nbsp;
|| &nbsp;
|}