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*M-SDNO: [mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel), [mailto:michael.gregoire@dell.com Michael Gregoire] (Dell), [mailto:corey.hartman@dell.com Corey Hartman] (Dell), and [mailto:andrew.junkins@amd.com Andy Junkins] (AMD) | *M-SDNO: [mailto:brian.d.aspnes@intel.com Brian Aspnes] (Intel), [mailto:michael.gregoire@dell.com Michael Gregoire] (Dell), [mailto:corey.hartman@dell.com Corey Hartman] (Dell), and [mailto:andrew.junkins@amd.com Andy Junkins] (AMD) | ||
*M-PnP: [mailto:tim.lambert@dell.com Tim Lambert] (Dell) and [mailto:phillip.leech@hpe.com Phil Leech] (HPE) | *M-PnP: [mailto:tim.lambert@dell.com Tim Lambert] (Dell) and [mailto:phillip.leech@hpe.com Phil Leech] (HPE) | ||
==Current Status== | ==Current Status== | ||
MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022. | |||
MHS workstreams are working the MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to MHS. An early version of the M-SIF specification (version 0.5) is included in the Latest MHS Specification section. | |||
A link to a Readme file explaining how to use the following tables (Latest | A link to a Readme file explaining how to use the following tables (Latest MHS Specifications, Errata and Supporting Documentation, and Inactive Documents) is here: [https://docs.google.com/presentation/d/1CyVsLCPpkJb0FV_ZOYjWndqE4AHATdh-/edit?usp=share_link&ouid=107990764505043211297&rtpof=true&sd=true Link] | ||
===Latest Released | ===Latest Released MHS Specifications=== | ||
Note: The Final Spec Agreement (FSA) for the latest specs has not yet been signed. You may access the released versions in the Contribution Database ([https://www.opencompute.org/contributions?query=DC-MHS Contribution Database]). | Note: The Final Spec Agreement (FSA) for the latest specs has not yet been signed. You may access the released versions in the Contribution Database ([https://www.opencompute.org/contributions?query=DC-MHS Contribution Database]). | ||
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|- | |- | ||
! Type !! Description !! Version !! Submit Date !! Contributor !! style="min-width:100px;"| Link !! Notes | ! Type !! Description !! Version !! Submit Date !! Contributor !! style="min-width:100px;"| Link !! Notes | ||
|- | |- | ||
| Specification | | Specification | ||
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|| Updates: | || Updates: | ||
*Added option to support 2nd DC-DCM and DSFF NIC for Class C/D HPMs | *Added option to support 2nd DC-DCM and DSFF NIC for Class C/D HPMs | ||
|- | |||
| Specification | |||
|| M-PESTI Base Specification | |||
|| 1.2 RC2 | |||
|| 3/14/24 | |||
|| Jeff Kennedy | |||
|| [https://drive.google.com/file/d/1QQ3GfDzTk5SxdgS-O8sTWjwuyzBsCmw2/view?usp=drive_link Link (no change bar)]<br>[https://drive.google.com/file/d/1IKukmYfK4odMg9vJ5KIzcDloc-O7WwiX/view?usp=drive_link Link (CB Version)] | |||
|| Several small updates including: | |||
*Modifying the presence pulldown range. | |||
*Amending payload format. | |||
|- | |||
| Specification | |||
|| M-XIO Base Specification | |||
|| 1.04 RC1 | |||
|| 2/28/24 | |||
|| Charlie Ziegler | |||
|| [https://drive.google.com/file/d/19YLMtsquBXUIfRlqPN4B73DY09cJBD3H/view?usp=drive_link Link (non CB Version)] | |||
[https://drive.google.com/file/d/16UX1dyT8h-sZ2pfIZBL7368XFY5Sz8ZO/view?usp=drive_link Link (CB version)] | |||
|| Updates: | |||
*Update compliance link. | |||
*Fix typos. | |||
|- | |- | ||
| Specification | | Specification | ||
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*Updated M-DNO to be consistent with M-SDNO | *Updated M-DNO to be consistent with M-SDNO | ||
|- | |- | ||
| Specification | | Specification | ||
|| M- | || M-PIC Base Specification 48V Addendum | ||
|| | || 0.3 | ||
|| 3/ | || 3/1/2024 | ||
|| | || Cliff DuBay | ||
|| [https://drive.google.com/file/d/ | || [https://drive.google.com/file/d/1s-LYJnZg-TUbDS0f_ufa7lx-AXCrfJXd/view?usp=drive_link 0.3 Link (non CB Version)]<br> | ||
[https://drive.google.com/file/d/1eoLctpEQ2kFhkVWWUuBd6LZsPAN3vHG8/view?usp=drive_link 0.3 Link (CB version)] | |||
[https://drive.google.com/file/d/ | |||
|| Updates: | || Updates: | ||
Early directional version (0.3) of the M-PIC Base Specification 48V Addendum. | |||
The 48V content is being developed in a separate document with the intent to integrate it into the main M-PIC specification once the content is ready. | |||
|- | |- | ||
| Specification | | Specification | ||
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|} | |} | ||
===Latest Released | ===Latest Released MHS MCAD=== | ||
{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | {| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | ||
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|- | |- | ||
| HPM | | HPM | ||
|| MHS Common Chassis Design for Differing HPM Thickness and CRPS Connector Offsets | || DC-MHS Common Chassis Design for Differing HPM Thickness and CRPS Connector Offsets | ||
|| Design Spec | || Design Spec | ||
|| PDF | || PDF | ||
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|| [https://drive.google.com/file/d/1vBpCg3VhXHFfzQfVmS6GGRWk6jGU_DOE/view?usp=drive_link Link] | || [https://drive.google.com/file/d/1vBpCg3VhXHFfzQfVmS6GGRWk6jGU_DOE/view?usp=drive_link Link] | ||
|| CRPS Design Specifications. | || CRPS Design Specifications. | ||
|- | |- | ||
| PIC | | PIC | ||
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==Communication== | ==Communication== | ||
*Project communication is done through [https://ocp-all.groups.io/g/OCP-MHS https://ocp-all.groups.io/g/OCP-MHS] | *Project communication is done through [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS] | ||
*Post: [mailto: | *Post: [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io] | ||
*Subscribe: [mailto: | *Subscribe: [mailto:OCP-DC-MHS+subscribe@OCP-All.groups.io OCP-DC-MHS+subscribe@OCP-All.groups.io] | ||
*Unsubscribe: [mailto: | *Unsubscribe: [mailto:OCP-DC-MHS+unsubscribe@OCP-All.groups.io OCP-DC-MHS+unsubscribe@OCP-All.groups.io] | ||
*''Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from [mailto: | *''Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from [mailto:OCP-DC-MHS@OCP-All.groups.io OCP-DC-MHS@OCP-All.groups.io]'' | ||
*''Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email'' | *''Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email'' | ||
*To access the mailing list archives go to [https://ocp-all.groups.io/g/ | *To access the mailing list archives go to [https://ocp-all.groups.io/g/OCP-DC-MHS https://ocp-all.groups.io/g/OCP-DC-MHS] | ||
==Meeting Schedule== | ==Meeting Schedule== | ||
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*Schedule is the third Wednesday of every month at 0800 PST. | *Schedule is the third Wednesday of every month at 0800 PST. | ||
*Each workstream has its own weekly meeting for companies that have signed the MHS R1 CLA. | *Each workstream has its own weekly meeting for companies that have signed the MHS R1 CLA. | ||
*[https://www.opencompute.org/projects/mhs OCP MHS Project Calendar] | *[https://www.opencompute.org/projects/dc-mhs OCP DC-MHS Project Calendar] | ||
==Recordings from Past Monthly Meeting Calls== | ==Recordings from Past Monthly Meeting Calls== | ||
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|| [https://drive.google.com/file/d/1HMjO4TsFTw04wltFQUaiUjsSsspvb_w3/view?usp=share_link Recording] | || [https://drive.google.com/file/d/1HMjO4TsFTw04wltFQUaiUjsSsspvb_w3/view?usp=share_link Recording] | ||
|| [https://docs.google.com/presentation/d/1PUfREdEHktxyDaP5mk85Ddvw-3Nn12Sd/edit?usp=share_link&ouid=107990764505043211297&rtpof=true&sd=true Slides] | || [https://docs.google.com/presentation/d/1PUfREdEHktxyDaP5mk85Ddvw-3Nn12Sd/edit?usp=share_link&ouid=107990764505043211297&rtpof=true&sd=true Slides] | ||
|} | |} | ||
==Slides/Recordings from October 2023 OCP Global Summit== | ==Slides/Recordings from October 2023 OCP Global Summit== | ||
There were a number of MHS Technical Talks and Experience Center Lightning Talks at the October 2023 OCP Global Summit in San Jose. The presentations and recordings are posted below. | There were a number of DC-MHS Technical Talks and Experience Center Lightning Talks at the October 2023 OCP Global Summit in San Jose. The presentations and recordings are posted below. | ||
{| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | {| class="wikitable" style="width: 100%; margin:auto; vertical-align:top; text-align:left;" | ||
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|| [https://drive.google.com/file/d/1iI-91bOFzT9ozsfpyTpKWpxrcpGDCafH/view?usp=drive_link Slides] | || [https://drive.google.com/file/d/1iI-91bOFzT9ozsfpyTpKWpxrcpGDCafH/view?usp=drive_link Slides] | ||
|} | |} | ||
==Slides/Recordings from April 2023 OCP Regional Summit== | ==Slides/Recordings from April 2023 OCP Regional Summit== | ||
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The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral | The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral | ||
*[ | *[http://www.opencompute.org/contributions http://www.opencompute.org/contributions] | ||
or the OCP Marketplace, Orderable Products | or the OCP Marketplace, Orderable Products | ||
*[ | *[http://www.opencompute.org/products http://www.opencompute.org/products] | ||
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents. | Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents. | ||