Server/MHS
Welcome
Welcome to the OCP Data Center – Modular Hardware System (DC-MHS) Sub-Project.
DC-MHS R1 envisions interoperability between key elements of datacenter, edge and enterprise infrastructure by providing consistent interfaces and form factors among modular building blocks.
DC-MHS R1 standardizes a collection of HPM (Host Processor Modules) form-factors and supporting ingredients to allow interoperability of HPMs and platforms.
There are five workstreams that comprise DC-MHS. The objectives of the five workstreams are the following:
- M-HPM (Host Processor Modules) Workstream which involves three specifications:
- M-FLW (FulL Width HPM)
- Specify the requirements of a Full Width Host Processor Module (HPM). This is for use within products designed for minimum 19” rack, also known as compliant with EIA-310-E but can also accommodate larger 21” racks. This form factor enables a full width HPM usage for CPUs, DIMMs, and related features.
- M-DNO (DeNsity Optimized HPM)
- Outline the requirements of a family of partial width, DeNsity Optimized Host Processor Module (HPM) form factors within the OCP Modular 240 hardware system group of specifications (M-DNO for short). This M-DNO specification embodies design considerations for CPU, DIMMs, and other server processor related features commonly used by the industry today but is not limited to only those functions.
- M-HPM.next
- Next HPM form factors under consideration
- M-FLW (FulL Width HPM)
- M-XIO/PESTI (eXtended I/O Connectivity/PEripheral SideBand Tunneling Interface)
- Outline the Modular Extensible I/O (M-XIO) source connector hardware strategy. An M-XIO source connector enables entry and exit points between sources such as Motherboards, Host Processor Modules & RAID Controllers, and peripheral subsystems such as PCIe risers, backplanes, etc. M-XIO includes the connector, high speed and management signal interface details and supported pinouts. Additionally, the workstream defines Interface (M-PESTI) base requirements for electrical and protocol compatibility between components of a DC-MHS platform. The M-PESTI protocol overloads a common PRSNT# signal with additional capabilities beyond simple presence/absence of a peripheral.
- M-PIC (Platform Infrastructure Connectivity)
- Defines and standardizes common elements needed to interface a Host Processor Module (HPM) to the platform/chassis infrastructure elements/subsystems within the DC-MHS 1.0 family of OCP servers. Standardization of the common interfaces and connectors enables hardware compatibility between DC-MHS HPMs and various DC-MHS system components.
- M-CRPS (Common Redundant Power Supply)
- Defines all the requirements for an M-CRPS internal redundant power supply used in Open Compute Project that could be used in different environments like home/office, datacenter, and high-performance computing, hence harmonizing the server power supply requirements used in the industry with the purpose of creating a standard specification that the customers and vendors of Enterprise and Hyperscale can use for their products.
- M-SIF (Shared InFrastructure)
- Improve interoperability related to shared infrastructure enclosures with multiple, serviceable modules. Modules containing elements (HPMs, DC-SCM, peripherals, etc.) are blind-matable and hot-pluggable into a shared infrastructure enclosure.
Disclaimer: Please do not submit any confidential information to the Project Community. All presentation materials, proposals, meeting minutes and/or supporting documents are published by OCP and are open to the public in accordance with OCP's Bylaws and IP Policy. This can be found on the OCP Policies page. If you have any questions please contact OCP.
Project Leadership
Sub-Project Leads
- Brian Aspnes (Intel)
- Shawn Dube (Dell)
Spec. Authors
- M-FLW: Brian Aspnes (Intel) and Corey Hartman (Dell)
- M-DNO: Dirk Blevins (Intel) and Michael Gregoire (Dell)
- M-XIO/PESTI: Charlie Ziegler (Dell) and Javier Lasa (Intel)
- M-PIC: Tim Lambert (Dell) and Cliff DuBay (Intel)
- M-CRPS: Aurelio Rodriguez Echevarria (Intel) and Jon Lewis (Dell)
- M-SIF: Dirk Blevins (Intel) and Greg Sellman (AMD)
DC-MHS Wiki Administrator
- John Dinsmoor (Intel)
Current Status
DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.
DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. An early version of the M-SIF specification (version 0.3) is included in the Latest DC-MHS Specification section.
A link to a Readme file explaining how to use the following tables (Latest DC-MHS Specifications, Errata and Supporting Documentation, and Inactive Documents) is here: Link
Latest Released DC-MHS Specifications
Type | Description | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|
Specification | M-CRPS Base Specification | 1.01 RC2 | 7/26/2023 | Aurelio Rodriguez Echevarria | 1.01 RC2 Link 1.01 RC2 Mechanical Drawings |
Update:
|
Specification | M-DNO Base Specification | 1.01 RC2 | 7/20/2023 | Mike Gregoire | 1.01 RC2 Link (non CB Version) 1.01 RC2 Link (CB version) |
Updates:
|
Specification | M-PESTI Base Specification | 1.1 RC5 | 7/18/2023 | Jeff Kennedy | 1.1 RC5 Link (no change bar) 1.1 RC5 Link (CB Version) |
Updates:
|
Specification | M-FLW Base Specification | v1.01 RC2 | 6/1/2023 | Brian Aspnes | 1.01 RC2 Link 1.01 RC2 Link (CB Version) |
|
Specification | (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2 | v0.3 RC2 | 5/16/2023 | Michael Gregoire | Link | (Directional) M-DNO Specification Updates for HPM Types 5-7 |
Specification | M-XIO Base Specification | 1.02 | 3/16/2023 | Javier Lasa | Version 1.02 Link |
|
Specification | M-PIC Base Specification | 1.02 | 3/13/2023 | Clifford DuBay | Version 1.02 Link |
|
Specification | M-SIF Base Specification | 0.3 | 3/9/2023 | Dirk Blevins | Link | Early version (0.3) of the M-SIF specification |
Latest Released DC-MHS MCAD
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 7 | STP | CAD | 6/01/2023 | Andrew Junkins | Link | Type 7 CAD Files - updated to match M-DNO v0.3 RC2 specification |
FLW | T1 FLW | STP | CAD | 5/23/2023 | Brian Aspnes | Link | |
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 6 | STP | CAD | 5/16/2023 | Brian Aspnes | Link | Type 6 CAD Files |
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 5 | STP | CAD | 5/16/2023 | Brian Aspnes | Link | Type 5 CAD Files |
DNO | DNO Type 4 MCAD | STP | CAD | 2/15/23 | Mike Gregoire | DNO Type 4 Link | Type 4 CAD |
DNO | DNO Type 3 MCAD | STP | CAD | 10/26/22 | Mike Gregoire | Link | Type 3 CAD Files |
DNO | DNO Type 2 MCAD | STP | CAD | 10/26/22 | Mike Gregoire | Link | Type 2 CAD Files |
DC-MHS Tools
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
CRPS | make_mcrps_config_file | Source Code | 1.0 | 7/26/2023 | Aurelio Rodriguez Echevarria | Folder Link Direct File Link |
M-CRPS Configuration file make tool, use CodeBlocks and GCC to compile the project. First release it only generates a .bin file from the header and the configuration area. |
Errata and Supporting Documentation
This section includes Errata and ECNs that have not been moved into a public spec release yet (these files supersede anything in the current released specs).
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
PIC | Current Connector List | Document | 1 | 2/1/2023 | Cliff DuBay | Link | M-PIC Connector List |
Inactive Documents
This section includes Workstream specification errata and any other working documents.
Spec Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
CRPS | Errata | RC4 Rev 2 | 4/25/23 | Aurelio Rodriguez Echevarria | Link | Corrections in Rev 1.0 RC4 of the M-CRPS specification. | |
CRPS | Errata | RC4 Rev 1 | 4/3/2023 | Aurelio Rodriguez Echevarria | Link | Fixes typos and drawing errors. | |
PIC | M-PIC Base Specification | 1.01 | 2/3/2023 | Clifford DuBay | Version 1.01 Change Bar |
| |
PIC | M-PIC Errata 1 and 2 | 1.0 | 2/1/2023 | Clifford DuBay | Link |
| |
XIO | M-XIO Base Specification | 1.01 RC1 | 1/24/2023 | Javier Lasa | Link | Incorporated Errata #1. ECN: Addition of cable construction considerations, incorporated cable considerations (alignment with PCI-SIG internal cable spec), clarification on P3V3_MGMT usage. | |
XIO | Errata | 1.0 | 12/12/2022 | Javier Lasa | Link | Update SFF-TA-1016 and SFF-TA-1033 pinouts. | |
XIO | M-XIO Specification | 1.0 RC4 | 9/28/2022 | Javier Lasa | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
PESTI | M-PESTI Specification | 1.0 RC2 | 9/28/2022 | Javier Lasa | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
DNO | M-DNO | 1.0 RC5 | 9/28/22 | Michael Gregoire | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
FLW | M-FLW Specification | 1.0 RC5 | 9/28/2022 | Corey Hartman | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
CRPS | M-CRPS Specification | 1.0 RC4 | 9/28/22 | Aurelio Rodriguez Echevarria | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
PIC | M-PIC Specification | 1.0 RC7 | 9/28/2022 | Clifford DuBay | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 |
Get Involved
Communication
- Project communication is done through https://ocp-all.groups.io/g/OCP-DC-MHS
- Post: OCP-DC-MHS@OCP-All.groups.io
- Subscribe: OCP-DC-MHS+subscribe@OCP-All.groups.io
- Unsubscribe: OCP-DC-MHS+unsubscribe@OCP-All.groups.io
- Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from OCP-DC-MHS@OCP-All.groups.io
- Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email
- To access the mailing list archives go to https://ocp-all.groups.io/g/OCP-DC-MHS
Meeting Schedule
For monthly public meetings:
- Schedule is the third Wednesday of every month at 0800 PST.
- Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.
- OCP DC-MHS Project Calendar
Recordings from Past Monthly Meeting Calls
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
DC-MHS HPM Workstream Updates (Brian Aspnes, Mike Gregoire, Javier Lasa, Aurelio Rodriguez Echevarria, Greg Sellman). Includes earlier OCP information on the Contribution Process for reference. | July 2023 Public Call | Recording | Slides OCP Contribution Process |
DC-MHS HPM Workstream Updates (Brian Aspnes, Andy Junkins, Aurelio Rodriguez Echevarria) | June 2023 Public Call | Recording | Slides |
DC-MHS HPM Workstream Updates and New Spec (Corey Hartman, Mike Gregoire, Aurelio Rodriguez Echevarria) | May 2023 Public Call HPM WS Update | Recording | HPM WS Update |
DC-MHS HPM Workstream Update (Corey Hartman, Mike Gregoire) and Delta and Artesyn Representatives | April 2023 Public Call | Recording | HPM WS Update |
DC-MHS Workstream and Subproject Leads | March 2023 Public Call | Recording | Slides |
Slides from April 2022 OCP Tech Talks
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Shawn Dube (Dell) Brian Aspnes (Intel) |
DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) | Recording | Slides |
Corey Hartman (Dell) Brian Aspnes (Intel) |
DC-MHS: FulL Width HPMs (M-FLW) | Recording | Slides |
Mike Gregoire (Dell) Dirk Blevins (Intel) |
DC-MHS: DeNsity Optimized HPMs (M-DNO) | Recording | Slides |
Cliff DuBay (Intel) Tim Lambert (Dell) |
DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) | Recording | Slides |
Charlie Ziegler (Dell) Javier Lasa (Intel) |
DC-MHS: eXtensible I/O (M-XIO) | Recording | Slides |
Tim Lambert (Dell) Javier Lasa (Intel) |
DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) | Recording | Slides |
Aurelio Rodriguez (Intel) Jon Lewis (Dell) |
DC-MHS: Common Redundant Power Supply (M-CRPS) | Recording | Slides |
Slides/Recordings from October 2022 OCP Global Summit
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Michael Leung (Google) Aurelio Rodriguez Echevarria (Intel) Corey Hartman (Dell) Tim Lambert (Dell) Eduardo Estrada (Intel) |
PANEL: DC-MHS R1 report-out and timeline | Recording | Slides |
Siamak Tavallaei (Google) Brian Aspnes (Intel) Shawn Dube (Dell) Jean-Marie Verdun (HPE) Dharmesh Jani (Meta) |
PANEL: Datacenter Modular Hardware System (DC-MHS) | Recording | Slides |
Dirk Blevins (Intel) Todd Westhauser (Meta) Vincent Nguyen (HPE) |
Practical Usage of DC-MHS M-DNO Concepts | Recording | Slides |
Siamak Tavallaei (Google) Dirk Blevins (Intel) |
Multi-host Modular Systems (M-SIF) | Recording | Slides |
OCP Marketplace Entries
The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral
or the OCP Marketplace, Orderable Products
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.
Type | Description | Version | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|---|