Server/MHS
Project Leadership
Spec. Authors
- M-FLW: Brian Aspnes (Intel) and Corey Hartman (Dell)
- M-DNO: Dirk Blevins (Intel) and Michael Gregoire (Dell)
- M-XIO/PESTI: Charlie Ziegler (Dell) and Javier Lasa (Intel)
- M-PIC: Tim Lambert (Dell), Cliff DuBay (Intel), Owen Kidd (48V Addendum) (Dell)
- M-CRPS: Aurelio Rodriguez Echevarria (Intel) and Jon Lewis (Dell)
- M-SIF: Dirk Blevins (Intel) and Greg Sellman (AMD)
- M-SDNO: Brian Aspnes (Intel), Michael Gregoire (Dell), Corey Hartman (Dell), and Andy Junkins (AMD)
- M-PnP: Tim Lambert (Dell) and Phil Leech (HPE)
Current Status
DC-MHS R1 v1.0 specs have been approved by the OCP Incubation Committee in November 2022.
DC-MHS workstreams are working the DC-MHS R1 v1.1 specifications. Note: M-SIF is a workstream new to DC-MHS. An early version of the M-SIF specification (version 0.5) is included in the Latest DC-MHS Specification section.
A link to a Readme file explaining how to use the following tables (Latest DC-MHS Specifications, Errata and Supporting Documentation, and Inactive Documents) is here: Link
Latest Released DC-MHS Specifications
Note: The Final Spec Agreement (FSA) for the latest specs has not yet been signed. You may access the released versions in the Contribution Database (Contribution Database).
Type | Description | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|
Specification | M-PIC Base Specification | 1.05 | 5/17/2024 | Cliff DuBay | 1.05 Link (non CB Version) |
Updates:
|
Specification | M-SDNO Base Specification | 0.9 RC2 | 4/18/24 | Mike Gregoire | Link (no change bar) Link (CB Version) |
Updates:
|
Specification | M-PESTI Base Specification | 1.2 RC2 | 3/14/24 | Jeff Kennedy | Link (no change bar) Link (CB Version) |
Several small updates including:
|
Specification | M-XIO Base Specification | 1.04 RC1 | 2/28/24 | Charlie Ziegler | Link (non CB Version) | Updates:
|
Specification | M-FLW Base Specification | 1.1 RC2 | 4/5/2024 | Brian Aspnes | Link (non CB Version) Link (CB version) |
Updates:
|
Specification | M-DNO Base Specification | 1.1 RC2 | 3/21/2024 | Mike Gregoire | Link (non CB Version) Link (CB version) |
Updates:
|
Specification | M-PIC Base Specification 48V Addendum | 0.3 | 3/1/2024 | Cliff DuBay | 0.3 Link (non CB Version) |
Updates:
Early directional version (0.3) of the M-PIC Base Specification 48V Addendum. The 48V content is being developed in a separate document with the intent to integrate it into the main M-PIC specification once the content is ready. |
Specification | M-CRPS Base Specification | 1.04 RC3 | 2/22/24 | Aurelio Rodriguez Echevarria | RC3 Link | Update:
|
Specification | M-SIF Base Specification | 0.5 | 10/2/2023 | Greg Sellman | 0.5 Link (non CB Version) | Updates to high-speed IO & management interfaces. Connectors defined. |
Latest Released DC-MHS MCAD
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
SDNO | M-SDNO Class “C” Zip CAD Files | STP | CAD | 4/18/24 | Andy Junkins | Link | Includes C305, C335, and C555. |
SDNO | M-SDNO Class “D” Zip CAD Files | STP | CAD | 4/18/24 | Andy Junkins | Link | Includes D305, D335, and D555. |
DNO | M-DNO Type 3 MCAD | STP | CAD | 3/21/24 | Brian Aspnes | Link | Type 3 CAD File |
SDNO | M-SDNO Class “A” Zip CAD Files | STP | CAD | 1/22/24 | Brian Aspnes | Link | Includes A305, A335, and A555. |
SDNO | M-SDNO Class “B” Zip CAD Files | STP | CAD | 1/22/24 | Brian Aspnes | Link | Includes B305, B335, and B555. |
FLW | T1 FLW | STP | CAD | 5/23/2023 | Brian Aspnes | Link | |
DNO | DNO Type 4 MCAD | STP | CAD | 2/15/23 | Mike Gregoire | DNO Type 4 Link | Type 4 CAD |
DNO | DNO Type 2 MCAD | STP | CAD | 10/26/22 | Mike Gregoire | Link | Type 2 CAD Files |
Latest Released Design Specs
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
CRPS | CRPS Design Specifications | Design Specs | Zip (inc PDF) | 5/13/24 | Aurelio Rodriguez Echevarria | Link | Zip File |
HPM | DC-MHS Common Chassis Design for Differing HPM Thickness and CRPS Connector Offsets | Design Spec | 4/17/24 | Patrick Hampton | Link | PDF File |
Errata and Supporting Documentation
This section includes Errata and ECNs that have not been moved into a public spec release yet (these files supersede anything in the current released specs).
Spec. Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
PIC | Current Connector List | Document | 1 | 2/1/2023 | Cliff DuBay | Link | M-PIC Connector List |
Inactive Documents
This section includes Workstream specification errata and any other working documents.
Spec Impacted | Name | Format | Version | Submit Date | Contributor | Link | Notes |
---|---|---|---|---|---|---|---|
CRPS | M-CRPS Design Specifications | Zip (inc PDF) | 1 | 4/17/2024 | Aurelio Rodriguez Echevarria | Link | CRPS Design Specifications. |
PIC | M-PIC Base Specification | 1.04 | 3/1/24 | Cliff DuBay | 1.04 Link (non CB Version) |
Update:
| |
SDNO/FLW/DNO | M-HPM 1033 Errata Document | 1 | 2/21/2024 | Mike Gregoire | Link | Corrected datum references when dimensioning 1033 riser locations which do not align with the released SFF-TA-1033 V1.0. | |
PIC | M_PIC_R1_V1.03_Errata | 1.03 | 2/1/2024 | Cliff DuBay | Link | Errata # 1: Update the description and requirements for the FULL_PWR_CYCLE_N/FLEXIO pin to avoid power-up failures. | |
SDNO | M-SDNO Base Specification | 0.7 RC3 | 1/29/24 | Brian Aspnes | 0.7 RC3 Link | Update:
| |
SDNO | M-SDNO Class “C” Zip CAD Files | STP | 0.7 | 1/22/24 | Brian Aspnes | Link | Includes C305, C335, and C555. |
SDNO | M-SDNO Class “D” Zip CAD Files | STP | 0.7 | 1/22/24 | Brian Aspnes | Link | Includes D305, D335, and D555. |
CRPS | M-CRPS Base Specification | 1.03 RC2 | 12/15/23 | Aurelio Rodriguez Echevarria | 1.03 RC2 Link | Update:
| |
XIO | M-XIO Base Specification | 1.03 | 11/21/23 | Javier Lasa | 1.03 Link (non CB Version) | Update:
| |
SNDO | M-SDNO Base Specification | 0.5 | 10/2/2023 | Brian Aspnes | 0.5 Link | Replaces the (Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2.pdf specification. | |
SDNO | M-SDNO Class “A” Zip CAD Files | STP | 0.5 | 10/2/23 | Brian Aspnes | Link | Includes A305, A335, and A555. |
SDNO | M-SDNO Class “B” Zip CAD Files | STP | 0.5 | 10/2/23 | Brian Aspnes | Link | Includes B305, B335, and B555. |
SDNO | M-SDNO Class “D” Zip CAD Files | STP | 0.5 | 10/2/23 | Brian Aspnes | Link | Includes D305, D335, and D555. |
PIC | M-PIC Base Specification | 1.03 | 9/28/2023 | Cliff DuBay | 1.03 Link (non CB Version) |
Update:
| |
CRPS | M-CRPS Base Specification | 1.02 RC2 | 8/23/2023 | Aurelio Rodriguez Echevarria | 1.02 RC2 Link |
Update:
| |
CRPS | M-CRPS Base Specification | 1.01 RC2 | 7/26/2023 | Aurelio Rodriguez Echevarria | 1.01 RC2 Link 1.01 RC2 Mechanical Drawings |
Update:
| |
M-DNO | M-DNO Base Specification | 1.01 RC2 | 7/20/23 | Mike Gregoire | 1.01 RC2 Link (non CB Version) |
Updates:
| |
PESTI | M-PESTI Base Specification | 1.1 RC5 | 7/18/2023 | Jeff Kennedy | 1.1 RC5 Link (no change bar) 1.1 RC5 Link (CB Version) |
Update:
| |
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 7 | STP | 1.0 | 6/1/23 | Andrew Junkins | Link | Type 7 CAD Files - updated to match M-DNO v0.3 RC2 specification |
FLW | M-FLW Base Specification | v1.01 RC2 | 6/1/2023 | Brian Aspnes | 1.01 RC2 Link 1.01 RC2 Link (CB Version) |
| |
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 6 | STP | 1.0 | 5/16/23 | Brian Aspnes | Link | Type 6 CAD Files |
(Directional) M-DNO Types 5-7 0p3 RC2 | Updated CAD Files for Type 5 | STP | 1.0 | 5/16/23 | Brian Aspnes | Link | Type 5 CAD Files |
(Directional) M-DNO Specification Updates for HPM Types 5-7 0p3 RC2 | M-DNO Base Specification | v0.3 RC2 | 5/16/23 | Mike Gregoire | 0.3 Link | (Directional) M-DNO Specification Updates for HPM Types 5-7 | |
SIF | M-SIF Base Specification | 0.3 | 3/29/2023 | Dirk Blevins | Link | Early version (0.3) of the M-SIF specification | |
XIO | M-XIO Base Specification | 1.02 | 3/16/2023 | Javier Lasa | Version 1.02 Link |
Update:
| |
PIC | M-PIC Base Specification | 1.02 | 3/13/2023 | Clifford DuBay | Version 1.02 Link |
Update:
| |
CRPS | Errata | RC4 Rev 2 | 4/25/23 | Aurelio Rodriguez Echevarria | Link | Corrections in Rev 1.0 RC4 of the M-CRPS specification. | |
CRPS | Errata | RC4 Rev 1 | 4/3/2023 | Aurelio Rodriguez Echevarria | Link | Fixes typos and drawing errors. | |
PIC | M-PIC Base Specification | 1.01 | 2/3/2023 | Clifford DuBay | Version 1.01 Change Bar |
| |
PIC | M-PIC Errata 1 and 2 | 1.0 | 2/1/2023 | Clifford DuBay | Link |
| |
XIO | M-XIO Base Specification | 1.01 RC1 | 1/24/2023 | Javier Lasa | Link | Incorporated Errata #1. ECN: Addition of cable construction considerations, incorporated cable considerations (alignment with PCI-SIG internal cable spec), clarification on P3V3_MGMT usage. | |
XIO | Errata | 1.0 | 12/12/2022 | Javier Lasa | Link | Update SFF-TA-1016 and SFF-TA-1033 pinouts. | |
DNO | M-DNO Type 3 CAD Files | STP | 1 | 10/26/22 | Mike Gregoire | Link | Type 3 CAD Files |
XIO | M-XIO Specification | 1.0 RC4 | 9/28/2022 | Javier Lasa | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
PESTI | M-PESTI Specification | 1.0 RC2 | 9/28/2022 | Javier Lasa | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
DNO | M-DNO | 1.0 RC5 | 9/28/22 | Michael Gregoire | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
FLW | M-FLW Specification | 1.0 RC5 | 9/28/2022 | Corey Hartman | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
CRPS | M-CRPS Specification | 1.0 RC4 | 9/28/22 | Aurelio Rodriguez Echevarria | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 | |
PIC | M-PIC Specification | 1.0 RC7 | 9/28/2022 | Clifford DuBay | Link | Reviewed in Oct meeting. Approved by the IC on 11/4/2022 |
Get Involved
Communication
- Project communication is done through https://ocp-all.groups.io/g/OCP-DC-MHS
- Post: OCP-DC-MHS@OCP-All.groups.io
- Subscribe: OCP-DC-MHS+subscribe@OCP-All.groups.io
- Unsubscribe: OCP-DC-MHS+unsubscribe@OCP-All.groups.io
- Please make sure to follow the steps until you receive 1) confirmation email from noreply@Groups.io 2) welcome email from OCP-DC-MHS@OCP-All.groups.io
- Please check your junk box and unblock noreply@Groups.io if you have trouble receiving the confirmation email
- To access the mailing list archives go to https://ocp-all.groups.io/g/OCP-DC-MHS
Meeting Schedule
For monthly public meetings:
- Schedule is the third Wednesday of every month at 0800 PST.
- Each workstream has its own weekly meeting for companies that have signed the DC-MHS R1 CLA.
- OCP DC-MHS Project Calendar
Recordings from Past Monthly Meeting Calls
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Cliff DuBay, Aurelio Rodriguez Echevarria) | May 2024 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Corey Hartman, Jeff Kennedy, Aurelio Rodriguez Echevarria, Phil Leech) | April 2024 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Charlie Ziegler, Cliff DuBay, Aurelio Rodriguez Echevarria, Greg Sellman, Dirk Blevins) | March 2024 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Corey Hartman, Dirk Blevins) | February 2024 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman, Dirk Blevins) | January 2024 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman) | September 2023 Public Call | Recording | Slides |
DC-MHS Workstream Updates (Brian Aspnes, Mike Gregoire, Aurelio Rodriguez Echevarria, Greg Sellman) | August 2023 Public Call | Recording | Slides |
DC-MHS HPM Workstream Updates (Brian Aspnes, Mike Gregoire, Javier Lasa, Aurelio Rodriguez Echevarria, Greg Sellman) Includes earlier OCP information on the Contribution Process for reference. | July 2023 Public Call | Recording | Slides OCP Contribution Process |
DC-MHS HPM Workstream Updates (Brian Aspnes, Andy Junkins, Aurelio Rodriguez Echevarria) | June 2023 Public Call | Recording | Slides |
DC-MHS HPM Workstream Updates and New Spec (Corey Hartman, Mike Gregoire, Aurelio Rodriguez Echevarria) | May 2023 Public Call HPM WS Update | Recording | HPM WS Update |
DC-MHS HPM Workstream Update (Corey Hartman, Mike Gregoire) and Delta and Artesyn Representatives | April 2023 Public Call | Recording | HPM WS Update |
DC-MHS Workstream and Subproject Leads | March 2023 Public Call | Recording | Slides |
Slides/Recordings from October 2023 OCP Global Summit
There were a number of DC-MHS Technical Talks and Experience Center Lightning Talks at the October 2023 OCP Global Summit in San Jose. The presentations and recordings are posted below.
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Paul Artman (AMD) Dirk Blevins (Intel) Rob Nance (Jabil) |
Design with DC-MHS | Video | Slides |
Dirk Blevins (Intel) Shawn Dube (Dell) Vincent Nguyen (HPE) |
Edge-MHS – Bringing Modular Hardware System to the Edge | Video | Slides |
Cliff DuBay (Intel) Shawn Dube (Dell) |
DC-MHS - 48V Support | Video | Slides |
Tim Lambert (Dell) Javier Lasa (Intel) Phillip Leech (HPE) |
DC-MHS's Road to Off-the-shelf/Interchangeable HPMs | Video | Slides |
Michael Gregoire (Dell) Brian Aspnes (Intel) Corey Hartman (Dell) Matt Bowman (Meta) Andrew Junkins (AMD) |
Panel - DC-MHS: Updates and New Form Factors from the M-HPM Team | Video | Slides |
Gregory D Sellman (AMD) Dirk Blevins (Intel) Damien Chong (Meta) |
DC-MHS Modular Shared Infrastructure (M-SIF) - Comprehending Multi-Node/Host | Video | Slides |
Tim Lambert (Dell) Mike Witkowski (HPE) Todd Rosedahl (IBM) Javier Lasa (Intel) |
DC-MHS: Peripheral Out-of-Band Management Evolution | Video | Slides |
Jeff Kennedy (Dell) Javier Lasa (Intel) Eduardo Estrada (Intel) |
DC-MHS, M-PESTI: What, Why and When to Use It. | Video | Slides |
Aurelio Rodriguez Echevarria (Intel) | DC-MHS: M-CRPS base specification and test setup updates | Video | Slides |
Chitrak Gupta (AMI) Justin Thaler (Jabil) |
Enabling DC-MHS Design for Future Datacenters with Dynamic Firmware | Video | Slides |
Munir Ahmad (Lattice) Lawrence Lo (Intel) Raghu Kondapalli (Axiado) |
Driving DC-SCM innovations and interoperability - presented by DC-MHS | Video | Slides |
Richard Caubang (Advanced Energy) Austen Cook (Jabil) Rob Nance (Jabil) Aurelio Rodriguez Echevarria (Intel) |
Cross Vendor Interoperability in Server Design and M-CRPS/Test board Demonstration Speakers - presented by DC-MHS | Video | Slides |
Slides/Recordings from April 2023 OCP Regional Summit
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Dirk Blevins (Intel) Paul Artman (AMD) Rob Nance (Jabil) |
Data Center Modular Hardware System (DC-MHS) Overview & Update | Video | Slides |
Slides/Recordings from October 2022 OCP Global Summit
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Michael Leung (Google) Aurelio Rodriguez Echevarria (Intel) Corey Hartman (Dell) Tim Lambert (Dell) Eduardo Estrada (Intel) |
PANEL: DC-MHS R1 report-out and timeline | Recording | Slides |
Siamak Tavallaei (Google) Brian Aspnes (Intel) Shawn Dube (Dell) Jean-Marie Verdun (HPE) Dharmesh Jani (Meta) |
PANEL: Datacenter Modular Hardware System (DC-MHS) | Recording | Slides |
Dirk Blevins (Intel) Todd Westhauser (Meta) Vincent Nguyen (HPE) |
Practical Usage of DC-MHS M-DNO Concepts | Recording | Slides |
Siamak Tavallaei (Google) Dirk Blevins (Intel) |
Multi-host Modular Systems (M-SIF) | Recording | Slides |
Slides/Recordings from April 2022 OCP Tech Talks
Presenter (Company) | Title | Recording | Slides |
---|---|---|---|
Shawn Dube (Dell) Brian Aspnes (Intel) |
DC-MHS Rev 1.0: Introduction and Overview (Datacenter - Modular Hardware System) | Recording | Slides |
Corey Hartman (Dell) Brian Aspnes (Intel) |
DC-MHS: FulL Width HPMs (M-FLW) | Recording | Slides |
Mike Gregoire (Dell) Dirk Blevins (Intel) |
DC-MHS: DeNsity Optimized HPMs (M-DNO) | Recording | Slides |
Cliff DuBay (Intel) Tim Lambert (Dell) |
DC-MHS: Peripheral Infrastructure Connectivity (M-PIC) | Recording | Slides |
Charlie Ziegler (Dell) Javier Lasa (Intel) |
DC-MHS: eXtensible I/O (M-XIO) | Recording | Slides |
Tim Lambert (Dell) Javier Lasa (Intel) |
DC-MHS: PEripheral Sideband Tunneling Interface (M-PESTI) | Recording | Slides |
Aurelio Rodriguez (Intel) Jon Lewis (Dell) |
DC-MHS: Common Redundant Power Supply (M-CRPS) | Recording | Slides |
OCP Marketplace Entries
The most recent documents will always be in the OCP Marketplace, Specifications & Design Collateral
or the OCP Marketplace, Orderable Products
Entries below are for ease of use and historical reference. Please use the marketplace links for the most recent documents.
Type | Description | Version | Submit Date | Contributor | License | Notes |
---|---|---|---|---|---|---|